3D Sensing Technology - Global Market Outlook (2017-2026)
According to Stratistics MRC, the Global 3D Sensing Technology Market is accounted for $882.10 million in 2017 and is expected to reach $4,982.90 million by 2026 growing at a CAGR of 21.2% during the forecast period. Some of the key factors influencing the market growth include increase in demand of biometric authentication, growing demand for 3d sensors in consumer electronics and increase in number of next generation smartphones around the globe. However, high maintenance cost and high refurbishment cost are restricting the market growth.
3D Sensing can be achieved by using a different number of technologies. In this technology provides object movement based on temporal change of angles, it provides movements in the form of numerical data. 3D sensing is the optical technology behind mobile face recognition and it depends on innovative optical components. There are some techniques for 3D sensing can be used to implement face recognition, and advanced optical components support all.
Based on the technology, the time of flight technology segment is constantly enhancing due to working mechanism, time of flight technology is heavily used across many industry verticals. However a large number of applications from consumer electronics to industrial applications integrated by a time of flight technology. By Geography, North America was the leading contributor to the global 3D sensing technology market during the forecast period. The contribution is primarily due to the booming 3D sensing technology marketplace along with the presence of well-established players across the region, especially driven by the U.S. and Canada.
Some of the key players in global 3D Sensing Technology market are Microsoft Corporation, Texas Instruments Incorporated, Finisar Corporation, AMS AG, PMD Technologies AG, Microchip Technology Inc., Infineon Technologies AG, LMI Technologies, Inc., Intel Corporation, Qualcomm Technologies, Inc., STMicroelectronics N.V., Cognex Corporation, OmniVision Technologies, Inc., ASUSTeK Computer Inc, Himax Technologies, Inc., Lumentum Holdings Inc. and IFM Electronic GmbH.
Sensor Types Covered:
• Image Sensor
• Proximity Sensors
• Pressure Sensor
• Gyro Sensor
• Other Sensor Types
• Time of Flight
• Stereoscopic Vision
• Structured Light Pattern
• Health Sensing
• Machine Vision
End User Covered:
• Consumer Electronics
• Security & Surveillance
• Media & Entertainment
• Other End Users
• North America
o Rest of Europe
• Asia Pacific
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o South Africa
o Rest of Middle East & Africa
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