Hermetic Packaging - Global Market Outlook (2018-2027)
According to Stratistics MRC, the Global Hermetic Packaging market accounted for $3.27 billion in 2018 and is expected to reach $6.98 billion by 2027 growing at a CAGR of 8.8% during the forecast period. Rising demand for energy, Growing adoption for protecting highly sensitive electronic components and increase in global aerospace and defense expenditure are the key factors driving the market growth. However, stringent standards may hinder the market growth.
Hermetic packaging is defined as propelled level bundling system which has its essential applications in electronic gadgets and it also has a usage in the semiconductor and electronics industry. This sort of packaging prevents liquids and gases from entering the package cavity. Additionally, owing to the hermetic package materials, these can withstand and work in higher temperatures. Moreover, this bundling keeps the semiconductor part from any kind of corrosion more productively than any other identical plastic packaging.
By Type, the Ceramic–Metal (CERTM) Sealing segment is constantly enhancing during forecast period due to the growing warm stun safe and low-porosity sort of hermetic packaging material. The CERTM sealed sensors are discovering potential applications in the automobile as they assure the safety of the passengers while offering failure-free operation. Based on geography, Asia Pacific is likely to have a huge demand attributed to the increasing energy needs in developing countries, such as China and India. Also, many countries in this region are now stepping up in space research activities, such as satellite launches and space exploration missions, which is expected to add to the high growth of the hermetic packaging market in APAC during the forecast period.
Some of the key players profiled in the Hermetic Packaging market include Texas Instruments, Schott, Micross Components, SGA Technologies, Complete Hermetics, Teledyne Microelectronics, Legacy Technologies, SHP, Egide, Willow Technologies, Materion, Ametek, Kyocera, Amkor, and Intersil.
• Transponder Glass
• Ceramic–Metal (CERTM) Sealing
• Glass–Metal Sealing (GTMS)
• Passivation Glass
• Reed Glass
Material Types Covered:
• Metal Can Packages
• Multilayer Ceramic Packages
• Pressed Ceramic Packages
Closing Techniques Covered:
• Crimp Connection
• Industrial Equipments
• Microelectromechanical systems (MEMS) Switches
• Oscillating Crystals
• Airbag Ignitors
End Users Covered:
• Military & Defense
• Consumer Electronics
• Aeronautics and Space
• Energy and Nuclear Safety
• North America
o Rest of Europe
• Asia Pacific
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o South Africa
o Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country level segments
- Market share analysis of the top industry players
- Strategic recommendations for the new entrants
- Covers Market data for the years 2017, 2018, 2019, 2023 and 2027
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
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