Memory Packaging Market
Memory Packaging Market Forecasts to 2028 – Global Analysis By Platform (Wire-Bond, Flip Chip and Others), Application (TSV Packaging, DRAM Packaging and Others), End User (Automotive, Medical Devices and Others) and By Geography
According to Stratistics MRC, the Global Memory Packaging Market is accounted for $32.43 billion in 2020 and is expected to reach $57.84 billion by 2028 growing at a CAGR of 7.5% during the forecast period. Growth in packaging and assembly infrastructure, rising demand for smartphones and growing popularity of autonomous driving are driving the market growth. However, thermal issues due to the miniaturization of memory are hampering the growth of the market.
Memory is made of small semiconductor chips similar to processors and should be packaged into less fragile and tiny chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, depending on product requirements, like performance, density, and cost.
Based on the end user, the automotive segment is going to have lucrative growth during the forecast period owing to increase in acceptance of DRAM memory. Furthermore, the growth is led by the trend of autonomous driving and in vehicle infotainment. By geography, Asia Pacific is going to have high growth during the forecast period which can be attributed to a wide range of applications in several consumer electronics, especially in tablets and smartphones.
Some of the key players profiled in the Memory Packaging Market include Apple Inc., ASE Group, Cisco Systems Inc., Dell EMC, Fujitsu Semiconductor Limited, Hana Micron Inc., IBM Corporation, Intel Corporation, Micron Technology Inc., Nanya Technology Corporation, Qualcomm Technologies Inc., Samsung Electronics Co. Ltd, SK Hynix Inc., STMicroelectronics and Toshiba Electronic Devices & Storage Corporation.
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Report Coverage |
Details |
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Published Year: |
2021 |
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Estimated Market Size in 2020: |
USD 32.43 billion |
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Estimated Period: |
2020 |
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Compound Annual Growth Rate (CAGR) from 2020 to 2028: |
7.5% |
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Predicted 2028 Value: |
USD 57.84 billion |
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Forecast Years: |
2021-2028 |
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Tables, Graphs & Figures |
114 |
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Chapters Covered: |
Platform, Application, End User and Region |
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Core Drivers and Opportunities: |
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Restraining Factors & Market Threats: |
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Platforms Covered:
• Wafer-Level Chip-Scale Packaging(WLCSP)
• Wire-Bond
• Flip-Chip
• Lead-Frame
• Through-Silicon Via (TSV)
Applications Covered:
• 3D Through-Silicon Via (TSV) Packaging
• Dynamic Random Access Memory (DRAM) Packaging
• Not AND (NAND) Flash Packaging
• Not OR (NOR) Flash Packaging
End Users Covered:
• Automotive
• Consumer Electronics
• Embedded Systems
• Information Technology (IT) & Telecom
• Medical Devices
• Military and Aerospace
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
o Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Key Questions Answered In The Report
The Global Memory Packaging Market is majorly driven by growth in packaging and assembly infrastructure, rising demand for smartphones and growing popularity of autonomous driving.
The automotive segment is growing at a highest CAGR owing to increase in acceptance of DRAM memory. Furthermore, the growth is led by the trend of autonomous driving and in vehicle infotainment.
North America dominated with a significant market share due to the factors such as presence of key market players and rapid growth in industrialization in the region.
Asia Pacific market is growing at a highest CAGR owing to the wide range of applications in several consumer electronics, especially in tablets and smartphones in the region.
Key players in Memory Packaging Market include Apple Inc., ASE Group, Cisco Systems Inc., Dell EMC, Fujitsu Semiconductor Limited, Hana Micron Inc., IBM Corporation, Intel Corporation, Micron Technology Inc., Nanya Technology Corporation, Qualcomm Technologies Inc., Samsung Electronics Co. Ltd, SK Hynix Inc., STMicroelectronics and Toshiba Electronic Devices & Storage Corporation.
Table of Contents
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Application Analysis
3.7 End User Analysis
3.8 Emerging Markets
3.9 Impact of Covid-19
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Memory Packaging Market, By Platform
5.1 Introduction
5.2 Wafer-Level Chip-Scale Packaging(WLCSP)
5.3 Wire-Bond
5.4 Flip-Chip
5.5 Lead-Frame
5.6 Through-Silicon Via (TSV)
6 Global Memory Packaging Market, By Application
6.1 Introduction
6.2 3D Through-Silicon Via (TSV) Packaging
6.3 Dynamic Random Access Memory (DRAM) Packaging
6.4 Not AND (NAND) Flash Packaging
6.5 Not OR (NOR) Flash Packaging
7 Global Memory Packaging Market, By End User
7.1 Introduction
7.2 Automotive
7.3 Consumer Electronics
7.4 Embedded Systems
7.5 Information Technology (IT) & Telecom
7.6 Medical Devices
7.7 Military and Aerospace
8 Global Memory Packaging Market, By Geography
8.1 Introduction
8.2 North America
8.2.1 US
8.2.2 Canada
8.2.3 Mexico
8.3 Europe
8.3.1 Germany
8.3.2 UK
8.3.3 Italy
8.3.4 France
8.3.5 Spain
8.3.6 Rest of Europe
8.4 Asia Pacific
8.4.1 Japan
8.4.2 China
8.4.3 India
8.4.4 Australia
8.4.5 New Zealand
8.4.6 South Korea
8.4.7 Rest of Asia Pacific
8.5 South America
8.5.1 Argentina
8.5.2 Brazil
8.5.3 Chile
8.5.4 Rest of South America
8.6 Middle East & Africa
8.6.1 Saudi Arabia
8.6.2 UAE
8.6.3 Qatar
8.6.4 South Africa
8.6.5 Rest of Middle East & Africa
9 Key Developments
9.1 Agreements, Partnerships, Collaborations and Joint Ventures
9.2 Acquisitions & Mergers
9.3 New Product Launch
9.4 Expansions
9.5 Other Key Strategies
10 Company Profiling
10.1 Apple Inc.
10.2 ASE Group
10.3 Cisco Systems Inc.
10.4 Dell EMC
10.5 Fujitsu Semiconductor Limited
10.6 Hana Micron Inc.
10.7 IBM Corporation
10.8 Intel Corporation
10.9 Micron Technology Inc.
10.10 Nanya Technology Corporation
10.11 Qualcomm Technologies Inc.
10.12 Samsung Electronics Co. Ltd
10.13 SK Hynix Inc.
10.14 STMicroelectronics
10.15 Toshiba Electronic Devices & Storage Corporation
List of Tables
1 Global Memory Packaging Market Outlook, By Region (2019-2028) (US $MN)
2 Global Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
3 Global Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
4 Global Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
5 Global Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
6 Global Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
7 Global Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
8 Global Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
9 Global Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
10 Global Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
11 Global Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
12 Global Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
13 Global Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
14 Global Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
15 Global Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
16 Global Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
17 Global Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
18 Global Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
19 Global Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
20 North America Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
21 North America Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
22 North America Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
23 North America Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
24 North America Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
25 North America Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
26 North America Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
27 North America Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
28 North America Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
29 North America Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
30 North America Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
31 North America Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
32 North America Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
33 North America Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
34 North America Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
35 North America Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
36 North America Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
37 North America Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
38 North America Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
39 Europe Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
40 Europe Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
41 Europe Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
42 Europe Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
43 Europe Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
44 Europe Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
45 Europe Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
46 Europe Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
47 Europe Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
48 Europe Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
49 Europe Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
50 Europe Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
51 Europe Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
52 Europe Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
53 Europe Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
54 Europe Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
55 Europe Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
56 Europe Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
57 Europe Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
58 Asia Pacific Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
59 Asia Pacific Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
60 Asia Pacific Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
61 Asia Pacific Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
62 Asia Pacific Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
63 Asia Pacific Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
64 Asia Pacific Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
65 Asia Pacific Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
66 Asia Pacific Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
67 Asia Pacific Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
68 Asia Pacific Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
69 Asia Pacific Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
70 Asia Pacific Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
71 Asia Pacific Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
72 Asia Pacific Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
73 Asia Pacific Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
74 Asia Pacific Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
75 Asia Pacific Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
76 Asia Pacific Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
77 South America Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
78 South America Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
79 South America Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
80 South America Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
81 South America Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
82 South America Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
83 South America Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
84 South America Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
85 South America Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
86 South America Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
87 South America Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
88 South America Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
89 South America Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
90 South America Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
91 South America Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
92 South America Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
93 South America Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
94 South America Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
95 South America Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
96 Middle East & Africa Memory Packaging Market Outlook, By Country (2019-2028) (US $MN)
97 Middle East & Africa Memory Packaging Market Outlook, By Platform (2019-2028) (US $MN)
98 Middle East & Africa Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging(WLCSP) (2019-2028) (US $MN)
99 Middle East & Africa Memory Packaging Market Outlook, By Wire-Bond (2019-2028) (US $MN)
100 Middle East & Africa Memory Packaging Market Outlook, By Flip-Chip (2019-2028) (US $MN)
101 Middle East & Africa Memory Packaging Market Outlook, By Lead-Frame (2019-2028) (US $MN)
102 Middle East & Africa Memory Packaging Market Outlook, By Through-Silicon Via (TSV) (2019-2028) (US $MN)
103 Middle East & Africa Memory Packaging Market Outlook, By Application (2019-2028) (US $MN)
104 Middle East & Africa Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2028) (US $MN)
105 Middle East & Africa Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2028) (US $MN)
106 Middle East & Africa Memory Packaging Market Outlook, By Not AND (NAND) Flash Packaging (2019-2028) (US $MN)
107 Middle East & Africa Memory Packaging Market Outlook, By Not OR (NOR) Flash Packaging (2019-2028) (US $MN)
108 Middle East & Africa Memory Packaging Market Outlook, By End User (2019-2028) (US $MN)
109 Middle East & Africa Memory Packaging Market Outlook, By Automotive (2019-2028) (US $MN)
110 Middle East & Africa Memory Packaging Market Outlook, By Consumer Electronics (2019-2028) (US $MN)
111 Middle East & Africa Memory Packaging Market Outlook, By Embedded Systems (2019-2028) (US $MN)
112 Middle East & Africa Memory Packaging Market Outlook, By Information Technology (IT) & Telecom (2019-2028) (US $MN)
113 Middle East & Africa Memory Packaging Market Outlook, By Medical Devices (2019-2028) (US $MN)
114 Middle East & Africa Memory Packaging Market Outlook, By Military and Aerospace (2019-2028) (US $MN)
List of Figures
RESEARCH METHODOLOGY
We at ‘Stratistics’ opt for an extensive research approach which involves data mining, data validation, and data analysis. The various research sources include in-house repository, secondary research, competitor’s sources, social media research, client internal data, and primary research.
Our team of analysts prefers the most reliable and authenticated data sources in order to perform the comprehensive literature search. With access to most of the authenticated data bases our team highly considers the best mix of information through various sources to obtain extensive and accurate analysis.
Each report takes an average time of a month and a team of 4 industry analysts. The time may vary depending on the scope and data availability of the desired market report. The various parameters used in the market assessment are standardized in order to enhance the data accuracy.
Data Mining
The data is collected from several authenticated, reliable, paid and unpaid sources and is filtered depending on the scope & objective of the research. Our reports repository acts as an added advantage in this procedure. Data gathering from the raw material suppliers, distributors and the manufacturers is performed on a regular basis, this helps in the comprehensive understanding of the products value chain. Apart from the above mentioned sources the data is also collected from the industry consultants to ensure the objective of the study is in the right direction.
Market trends such as technological advancements, regulatory affairs, market dynamics (Drivers, Restraints, Opportunities and Challenges) are obtained from scientific journals, market related national & international associations and organizations.
Data Analysis
From the data that is collected depending on the scope & objective of the research the data is subjected for the analysis. The critical steps that we follow for the data analysis include:
- Product Lifecycle Analysis
- Competitor analysis
- Risk analysis
- Porters Analysis
- PESTEL Analysis
- SWOT Analysis
The data engineering is performed by the core industry experts considering both the Marketing Mix Modeling and the Demand Forecasting. The marketing mix modeling makes use of multiple-regression techniques to predict the optimal mix of marketing variables. Regression factor is based on a number of variables and how they relate to an outcome such as sales or profits.
Data Validation
The data validation is performed by the exhaustive primary research from the expert interviews. This includes telephonic interviews, focus groups, face to face interviews, and questionnaires to validate our research from all aspects. The industry experts we approach come from the leading firms, involved in the supply chain ranging from the suppliers, distributors to the manufacturers and consumers so as to ensure an unbiased analysis.
We are in touch with more than 15,000 industry experts with the right mix of consultants, CEO's, presidents, vice presidents, managers, experts from both supply side and demand side, executives and so on.
The data validation involves the primary research from the industry experts belonging to:
- Leading Companies
- Suppliers & Distributors
- Manufacturers
- Consumers
- Industry/Strategic Consultants
Apart from the data validation the primary research also helps in performing the fill gap research, i.e. providing solutions for the unmet needs of the research which helps in enhancing the reports quality.
For more details about research methodology, kindly write to us at info@strategymrc.com
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