Advanced Semiconductor Packaging Market
Advanced Semiconductor Packaging Market Forecasts to 2030 - Global Analysis By Packaging Type (2D Packaging, 3D Packaging, System-in-Package (SiP), Fan-Out Wafer-Level Packaging (FOWLP), Flip Chip Packaging and Other Packaging Types), Device Type, Material Type, Technology, Application, End User and By Geography
|
Years Covered |
2022-2030 |
|
Estimated Year Value (2024) |
US $34.5 BN |
|
Projected Year Value (2030) |
US $52.4 BN |
|
CAGR (2024 - 2030) |
7.2% |
|
Regions Covered |
North America, Europe, Asia Pacific, South America, and Middle East & Africa |
|
Countries Covered |
US, Canada, Mexico, Germany, UK, Italy, France, Spain, Japan, China, India, Australia, New Zealand, South Korea, Rest of Asia Pacific, South America, Argentina, Brazil, Chile, Middle East & Africa, Saudi Arabia, UAE, Qatar, and South Africa |
|
Largest Market |
North America |
|
Highest Growing Market |
Asia Pacific |
According to Stratistics MRC, the Global Advanced Semiconductor Packaging Market is accounted for $34.5 billion in 2024 and is expected to reach $52.4 billion by 2030 growing at a CAGR of 7.2% during the forecast period. Advanced Semiconductor Packaging involves cutting-edge techniques designed to enhance the performance and efficiency of integrated circuits through innovative packaging solutions. This includes methods like 3D stacking, system-in-package (SiP), and chiplet architectures, enabling greater miniaturization and improved thermal management. By optimizing the arrangement and connections of semiconductor components, advanced packaging achieves faster data transfer and lower power consumption.
Market Dynamics:
Driver:
Increased demand for electronics
As consumer electronics, IoT devices, and automotive technologies become more complex and feature-rich, the need for efficient, high-performance packaging solutions has surged. Advanced packaging techniques enable greater functionality in smaller form factors, catering to trends like miniaturization and energy efficiency. Additionally, the rise of artificial intelligence and 5G connectivity further propels this demand, as these technologies require advanced integration and robust performance, reinforcing the market's expansion.
Restraint:
Complexity of integration
Increasing complexity in semiconductor designs raises the possibility of flaws, which raises failure rates and lowers yield. Moreover, the intricate interconnections and dependencies can complicate the manufacturing process, resulting in longer production times and elevated costs. This complexity also makes it difficult to ensure reliability and thermal management, potentially hindering the overall performance of electronic devices and limiting innovation in the industry.
Opportunity:
Technological advancements
Innovations such as 3D packaging, chiplet architectures, and fan-out wafer-level packaging enhance performance while reducing size and power consumption. Techniques like through-silicon vias (TSVs) and advanced thermal management solutions improve connectivity and heat dissipation. These advancements not only enable higher integration density and faster data transfer rates but also support emerging applications in artificial intelligence, 5G, and Internet of Things (IoT) devices, driving industry growth.
Threat:
High manufacturing costs
High manufacturing costs in the market can significantly hinder industry growth and innovation. As the complexity of packaging technologies increases, so do the expenses associated with materials, equipment, and skilled labor. This financial burden can lead to reduced profit margins for manufacturers, limiting their ability to invest in research and development. Additionally, elevated costs can impede the widespread adoption of advanced packaging solutions, slowing down technological advancements across various sectors.
Covid-19 Impact:
The COVID-19 pandemic had a profound impact on the market, disrupting supply chains and causing delays in manufacturing. Lockdowns and restrictions led to a temporary shutdown of production facilities, exacerbating component shortages. Increased demand for electronics driven by remote work and digital transformation—further strained the market. While the pandemic highlighted the importance of advanced packaging for efficient and compact devices, it also exposed vulnerabilities in global supply networks, prompting companies to rethink sourcing strategies and invest in more resilient systems.
The organic substrates segment is projected to be the largest during the forecast period
The organic substrates segment is projected to account for the largest market share during the projection period. These substrates offer several advantages, including lightweight properties, compatibility with various fabrication processes. They enable intricate circuit designs and support high-density interconnections, essential for modern electronics. Additionally, organic substrates contribute to improved thermal performance and reliability, making them ideal for applications in consumer electronics, telecommunications, and automotive industries.
The image sensors segment is expected to have the highest CAGR during the forecast period
The image sensors segment is expected to have the highest CAGR during the extrapolated period. These sensors require advanced packaging solutions to enhance performance, improve integration, and minimize size while maintaining image quality. With rising demand in applications such as smartphones, automotive, and security systems, the focus on effective thermal management and protection for image sensors is essential, further propelling advancements in semiconductor packaging.
Region with largest share:
North America region is projected to account for the largest market share during the forecast period fueled by the region's strong emphasis on technological innovation and research. Additionally, government initiatives aimed at strengthening domestic manufacturing capabilities and reducing supply chain vulnerabilities are fostering a favorable environment for advancements in semiconductor packaging, positioning the region as a key player in the global landscape.
Region with highest CAGR:
Asia Pacific is expected to register the highest growth rate over the forecast period driven by robust demand from various sectors including consumer electronics, automotive. The surge in consumer electronics adoption and advancements in telecommunications technologies are fueling the demand for advanced packaging solutions. Various government policies aimed at boosting local manufacturing capabilities and attracting foreign investments are further enhancing market dynamics.
Key players in the market
Some of the key players in Advanced Semiconductor Packaging market include Samsung Electronics, Intel Corporation, Qualcomm Technologies Inc., IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, Analog Devices, STMicroelectronics, Infineon Technologies AG, Avery Dennison Corporation, Sumitomo Chemical Co., Ltd., Powertech Technology Inc.Fujitsu Semiconductor Ltd., NVIDIA Corporation and LG Chem.
Key Developments:
In August 2024, Veeco Instruments Inc. announced that IBM selected the WaferStorm® Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.
In June 2024, Rapidus Corporation and IBM announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space.
Packaging Types Covered:
• 2D Packaging
• 3D Packaging
• System-in-Package (SiP)
• Fan-Out Wafer-Level Packaging (FOWLP)
• Flip Chip Packaging
• Other Packaging Types
Device Types Covered:
• Logic Devices
• Memory Devices
• Power Devices
Material Types Covered:
• Silicon
• Organic Substrates
• Ceramic
• Glass
• Other Material Types
Technologies Covered:
• Wafer-Level Packaging (WLP)
• Multi-Chip Packages (MCP)
• Through-Silicon Via (TSV)
Applications Covered:
• Processor
• Graphical Processing Units (GPUs)
• Dynamic Random Access Memory (DRAM)
• NAND Flash Memory
• Image Sensors
• Other Applications
End Users Covered:
• Telecommunications
• Automotive
• Aerospace and Defense
• Medical Devices
• Consumer Electronics
• Other End Users
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
o Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Table of Contents
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 Application Analysis
3.8 End User Analysis
3.9 Emerging Markets
3.10 Impact of Covid-19
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Advanced Semiconductor Packaging Market, By Packaging Type
5.1 Introduction
5.2 2D Packaging
5.3 3D Packaging
5.4 System-in-Package (SiP)
5.5 Fan-Out Wafer-Level Packaging (FOWLP)
5.6 Flip Chip Packaging
5.7 Other Packaging Types
6 Global Advanced Semiconductor Packaging Market, By Device Type
6.1 Introduction
6.2 Logic Devices
6.3 Memory Devices
6.4 Power Devices
7 Global Advanced Semiconductor Packaging Market, By Material Type
7.1 Introduction
7.2 Silicon
7.3 Organic Substrates
7.4 Ceramic
7.5 Glass
7.6 Other Material Types
8 Global Advanced Semiconductor Packaging Market, By Technology
8.1 Introduction
8.2 Wafer-Level Packaging (WLP)
8.3 Multi-Chip Packages (MCP)
8.4 Through-Silicon Via (TSV)
9 Global Advanced Semiconductor Packaging Market, By Application
9.1 Introduction
9.2 Processor
9.3 Graphical Processing Units (GPUs)
9.4 Dynamic Random Access Memory (DRAM)
9.5 NAND Flash Memory
9.6 Image Sensors
9.7 Other Applications
10 Global Advanced Semiconductor Packaging Market, By End User
10.1 Introduction
10.2 Telecommunications
10.3 Automotive
10.4 Aerospace and Defense
10.5 Medical Devices
10.6 Consumer Electronics
10.7 Other End Users
11 Global Advanced Semiconductor Packaging Market, By Geography
11.1 Introduction
11.2 North America
11.2.1 US
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 Germany
11.3.2 UK
11.3.3 Italy
11.3.4 France
11.3.5 Spain
11.3.6 Rest of Europe
11.4 Asia Pacific
11.4.1 Japan
11.4.2 China
11.4.3 India
11.4.4 Australia
11.4.5 New Zealand
11.4.6 South Korea
11.4.7 Rest of Asia Pacific
11.5 South America
11.5.1 Argentina
11.5.2 Brazil
11.5.3 Chile
11.5.4 Rest of South America
11.6 Middle East & Africa
11.6.1 Saudi Arabia
11.6.2 UAE
11.6.3 Qatar
11.6.4 South Africa
11.6.5 Rest of Middle East & Africa
12 Key Developments
12.1 Agreements, Partnerships, Collaborations and Joint Ventures
12.2 Acquisitions & Mergers
12.3 New Product Launch
12.4 Expansions
12.5 Other Key Strategies
13 Company Profiling
13.1 Samsung Electronics
13.2 Intel Corporation
13.3 Qualcomm Technologies Inc.
13.4 IBM
13.5 Microchip Technology
13.6 Renesas Electronics Corporation
13.7 Texas Instruments
13.8 Analog Devices
13.9 STMicroelectronics
13.10 Infineon Technologies AG
13.11 Avery Dennison Corporation
13.12 Sumitomo Chemical Co., Ltd.
13.13 Powertech Technology Inc.
13.14 Fujitsu Semiconductor Ltd.
13.15 NVIDIA Corporation
13.16 LG Chem
List of Tables
1 Global Advanced Semiconductor Packaging Market Outlook, By Region (2022-2030) ($MN)
2 Global Advanced Semiconductor Packaging Market Outlook, By Packaging Type (2022-2030) ($MN)
3 Global Advanced Semiconductor Packaging Market Outlook, By 2D Packaging (2022-2030) ($MN)
4 Global Advanced Semiconductor Packaging Market Outlook, By 3D Packaging (2022-2030) ($MN)
5 Global Advanced Semiconductor Packaging Market Outlook, By System-in-Package (SiP) (2022-2030) ($MN)
6 Global Advanced Semiconductor Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2022-2030) ($MN)
7 Global Advanced Semiconductor Packaging Market Outlook, By Flip Chip Packaging (2022-2030) ($MN)
8 Global Advanced Semiconductor Packaging Market Outlook, By Other Packaging Types (2022-2030) ($MN)
9 Global Advanced Semiconductor Packaging Market Outlook, By Device Type (2022-2030) ($MN)
10 Global Advanced Semiconductor Packaging Market Outlook, By Logic Devices (2022-2030) ($MN)
11 Global Advanced Semiconductor Packaging Market Outlook, By Memory Devices (2022-2030) ($MN)
12 Global Advanced Semiconductor Packaging Market Outlook, By Power Devices (2022-2030) ($MN)
13 Global Advanced Semiconductor Packaging Market Outlook, By Material Type (2022-2030) ($MN)
14 Global Advanced Semiconductor Packaging Market Outlook, By Silicon (2022-2030) ($MN)
15 Global Advanced Semiconductor Packaging Market Outlook, By Organic Substrates (2022-2030) ($MN)
16 Global Advanced Semiconductor Packaging Market Outlook, By Ceramic (2022-2030) ($MN)
17 Global Advanced Semiconductor Packaging Market Outlook, By Glass (2022-2030) ($MN)
18 Global Advanced Semiconductor Packaging Market Outlook, By Other Material Types (2022-2030) ($MN)
19 Global Advanced Semiconductor Packaging Market Outlook, By Technology (2022-2030) ($MN)
20 Global Advanced Semiconductor Packaging Market Outlook, By Wafer-Level Packaging (WLP) (2022-2030) ($MN)
21 Global Advanced Semiconductor Packaging Market Outlook, By Multi-Chip Packages (MCP) (2022-2030) ($MN)
22 Global Advanced Semiconductor Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
23 Global Advanced Semiconductor Packaging Market Outlook, By Application (2022-2030) ($MN)
24 Global Advanced Semiconductor Packaging Market Outlook, By Processor (2022-2030) ($MN)
25 Global Advanced Semiconductor Packaging Market Outlook, By Graphical Processing Units (GPUs) (2022-2030) ($MN)
26 Global Advanced Semiconductor Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) (2022-2030) ($MN)
27 Global Advanced Semiconductor Packaging Market Outlook, By NAND Flash Memory (2022-2030) ($MN)
28 Global Advanced Semiconductor Packaging Market Outlook, By Image Sensors (2022-2030) ($MN)
29 Global Advanced Semiconductor Packaging Market Outlook, By Other Applications (2022-2030) ($MN)
30 Global Advanced Semiconductor Packaging Market Outlook, By End User (2022-2030) ($MN)
31 Global Advanced Semiconductor Packaging Market Outlook, By Telecommunications (2022-2030) ($MN)
32 Global Advanced Semiconductor Packaging Market Outlook, By Automotive (2022-2030) ($MN)
33 Global Advanced Semiconductor Packaging Market Outlook, By Aerospace and Defense (2022-2030) ($MN)
34 Global Advanced Semiconductor Packaging Market Outlook, By Medical Devices (2022-2030) ($MN)
35 Global Advanced Semiconductor Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
36 Global Advanced Semiconductor Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.
List of Figures
RESEARCH METHODOLOGY
We at ‘Stratistics’ opt for an extensive research approach which involves data mining, data validation, and data analysis. The various research sources include in-house repository, secondary research, competitor’s sources, social media research, client internal data, and primary research.
Our team of analysts prefers the most reliable and authenticated data sources in order to perform the comprehensive literature search. With access to most of the authenticated data bases our team highly considers the best mix of information through various sources to obtain extensive and accurate analysis.
Each report takes an average time of a month and a team of 4 industry analysts. The time may vary depending on the scope and data availability of the desired market report. The various parameters used in the market assessment are standardized in order to enhance the data accuracy.
Data Mining
The data is collected from several authenticated, reliable, paid and unpaid sources and is filtered depending on the scope & objective of the research. Our reports repository acts as an added advantage in this procedure. Data gathering from the raw material suppliers, distributors and the manufacturers is performed on a regular basis, this helps in the comprehensive understanding of the products value chain. Apart from the above mentioned sources the data is also collected from the industry consultants to ensure the objective of the study is in the right direction.
Market trends such as technological advancements, regulatory affairs, market dynamics (Drivers, Restraints, Opportunities and Challenges) are obtained from scientific journals, market related national & international associations and organizations.
Data Analysis
From the data that is collected depending on the scope & objective of the research the data is subjected for the analysis. The critical steps that we follow for the data analysis include:
- Product Lifecycle Analysis
- Competitor analysis
- Risk analysis
- Porters Analysis
- PESTEL Analysis
- SWOT Analysis
The data engineering is performed by the core industry experts considering both the Marketing Mix Modeling and the Demand Forecasting. The marketing mix modeling makes use of multiple-regression techniques to predict the optimal mix of marketing variables. Regression factor is based on a number of variables and how they relate to an outcome such as sales or profits.
Data Validation
The data validation is performed by the exhaustive primary research from the expert interviews. This includes telephonic interviews, focus groups, face to face interviews, and questionnaires to validate our research from all aspects. The industry experts we approach come from the leading firms, involved in the supply chain ranging from the suppliers, distributors to the manufacturers and consumers so as to ensure an unbiased analysis.
We are in touch with more than 15,000 industry experts with the right mix of consultants, CEO's, presidents, vice presidents, managers, experts from both supply side and demand side, executives and so on.
The data validation involves the primary research from the industry experts belonging to:
- Leading Companies
- Suppliers & Distributors
- Manufacturers
- Consumers
- Industry/Strategic Consultants
Apart from the data validation the primary research also helps in performing the fill gap research, i.e. providing solutions for the unmet needs of the research which helps in enhancing the reports quality.
For more details about research methodology, kindly write to us at info@strategymrc.com
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