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Memory Packaging Market

Memory Packaging Market Forecasts to 2028 – Global Analysis By Platform (Wire-Bond, Flip Chip and Others), Application (TSV Packaging, DRAM Packaging and Others), End User (Automotive, Medical Devices and Others) and By Geography

5.0 (24 reviews)
Published: August 2021 ID: SMRC20885
5.0 (24 reviews)
Published: August 2021 ID: SMRC20885

This report covers the impact of COVID-19 on this global market
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According to Stratistics MRC, the Global Memory Packaging Market is accounted for $32.43 billion in 2020 and is expected to reach $57.84 billion by 2028 growing at a CAGR of 7.5% during the forecast period. Growth in packaging and assembly infrastructure, rising demand for smartphones and growing popularity of autonomous driving are driving the market growth. However, thermal issues due to the miniaturization of memory are hampering the growth of the market.

Memory is made of small semiconductor chips similar to processors and should be packaged into less fragile and tiny chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, depending on product requirements, like performance, density, and cost.

Based on the end user, the automotive segment is going to have lucrative growth during the forecast period owing to increase in acceptance of DRAM memory. Furthermore, the growth is led by the trend of autonomous driving and in vehicle infotainment. By geography, Asia Pacific is going to have high growth during the forecast period which can be attributed to a wide range of applications in several consumer electronics, especially in tablets and smartphones.

Some of the key players profiled in the Memory Packaging Market include Apple Inc., ASE Group, Cisco Systems Inc., Dell EMC, Fujitsu Semiconductor Limited, Hana Micron Inc., IBM Corporation, Intel Corporation, Micron Technology Inc., Nanya Technology Corporation, Qualcomm Technologies Inc., Samsung Electronics Co. Ltd, SK Hynix Inc., STMicroelectronics and Toshiba Electronic Devices & Storage Corporation.

Report Coverage

Details

Published Year:

2021

Estimated Market Size in 2020:

USD 32.43 billion

Estimated Period:

2020

Compound Annual Growth Rate (CAGR) from 2020 to 2028:

7.5%

Predicted 2028 Value:

USD 57.84 billion

Forecast Years:

2021-2028

Tables, Graphs & Figures

114

Chapters Covered:

Platform, Application, End User and Region

Core Drivers and Opportunities:

  • Growth in packaging and assembly infrastructure
  • Rising demand for smartphones
  • Growing popularity of autonomous driving

Restraining Factors & Market Threats:

  • Thermal issues due to the miniaturization of memory


Platforms Covered:
• Wafer-Level Chip-Scale Packaging(WLCSP)
• Wire-Bond
• Flip-Chip
• Lead-Frame
• Through-Silicon Via (TSV)

Applications Covered:
• 3D Through-Silicon Via (TSV) Packaging
• Dynamic Random Access Memory (DRAM) Packaging
• Not AND (NAND) Flash Packaging
• Not OR (NOR) Flash Packaging   

End Users Covered:
• Automotive
• Consumer Electronics
• Embedded Systems
• Information Technology (IT) & Telecom
• Medical Devices
• Military and Aerospace

Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan       
o China       
o India       
o Australia 
o New Zealand
o South Korea
o Rest of Asia Pacific   
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements

Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
o Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Key Questions Answered In The Report

The Global Memory Packaging Market is majorly driven by growth in packaging and assembly infrastructure, rising demand for smartphones and growing popularity of autonomous driving.

The automotive segment is growing at a highest CAGR owing to increase in acceptance of DRAM memory. Furthermore, the growth is led by the trend of autonomous driving and in vehicle infotainment.

North America dominated with a significant market share due to the factors such as presence of key market players and rapid growth in industrialization in the region.

Asia Pacific market is growing at a highest CAGR owing to the wide range of applications in several consumer electronics, especially in tablets and smartphones in the region.

Key players in Memory Packaging Market include Apple Inc., ASE Group, Cisco Systems Inc., Dell EMC, Fujitsu Semiconductor Limited, Hana Micron Inc., IBM Corporation, Intel Corporation, Micron Technology Inc., Nanya Technology Corporation, Qualcomm Technologies Inc., Samsung Electronics Co. Ltd, SK Hynix Inc., STMicroelectronics and Toshiba Electronic Devices & Storage Corporation.

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