Molded Interconnect Devices Mid Market
Molded Interconnect Devices (MID) Market Forecasts to 2030 - Global Analysis By Product Type (Antenna & Connectivity Modules, Connectors & Switches and Other Product Types), By Process (Laser Direct Structuring (LDS), Film Techniques and Two-Shot Molding), End User and By Geography
|
Years Covered |
2021-2030 |
|
Estimated Year Value (2023) |
US $1.3 BN |
|
Projected Year Value (2030) |
US $3.5 BN |
|
CAGR (2023-2030) |
14.4% |
|
Regions Covered |
North America, Europe, Asia Pacific, South America, and Middle East & Africa |
|
Countries Covered |
US, Canada, Mexico, Germany, UK, Italy, France, Spain, Japan, China, India, Australia, New Zealand, South Korea, Rest of Asia Pacific, South America, Argentina, Brazil, Chile, Middle East & Africa, Saudi Arabia, UAE, Qatar, and South Africa |
|
Largest Market |
North America |
|
Highest Growing Market |
Asia Pacific |
According to Stratistics MRC, the Global Molded Interconnect Devices (MID) Market is accounted for $1.3 billion in 2023 and is expected to reach $3.5 billion by 2030 growing at a CAGR of 14.4% during the forecast period. Molded Interconnect Devices (MID) are three-dimensional circuit structures formed by integrating electronics directly into injection-molded plastic components. This technology enables compact and lightweight designs, combining mechanical and electrical functions in a single part. MID is utilized in various industries, such as automotive and consumer electronics, to create efficient and space-saving electronic devices.
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Market Dynamics:
Driver:
Growing demand for connected devices
The increasing demand for connected devices, driven by trends like the Internet of Things (IoT), is a key driver in the molded interconnect devices (MID) market. MID technology allows the seamless integration of electronic components into three-dimensional structures, enabling compact and multifunctional devices. As the demand for smart and interconnected products rises across industries such as automotive, healthcare and consumer electronics, MID's ability to efficiently combine mechanical and electrical functions positions it as a crucial solution for meeting these evolving market needs.
Restraint:
High initial investment costs
Establishing the infrastructure for MID production, including specialized machinery and technology, requires substantial financial resources. Companies face challenges in allocating funds for research, development and production setup, hindering widespread adoption. The financial barriers limit market entry for potential competitors and may slow down the overall growth of the MID market.
Opportunity:
Advancements in manufacturing technologies
Advancements in manufacturing technologies present a significant opportunity in the molded interconnect device (MID) market by enhancing production efficiency and expanding design possibilities. Innovations like additive manufacturing, laser direct structuring, and 3D printing enable more intricate and customized MID designs. This streamlines the manufacturing process and allows for the integration of complex electronic functionalities. As a result, the MID market can capitalize on these advancements to offer more sophisticated, compact and cost-effective solutions, fostering industry growth.
Threat:
Fluctuations in raw material prices
Fluctuations in raw material prices pose a significant threat to the molded interconnect device (MID) market. As MID relies on specialized materials for both electronic and structural components, any volatility in the prices of these raw materials can impact production costs and overall profitability. Manufacturers may face challenges in maintaining competitive pricing and the uncertainty in material costs can disrupt supply chains, affecting the stability and growth of the MID market.
Covid-19 Impact:
The COVID-19 pandemic has impacted the molded interconnect devices (MID) market by disrupting global supply chains, causing production delays and affecting consumer demand. Lockdowns, social distancing measures and economic uncertainties have led to challenges in manufacturing and distribution. Additionally, shifts in priorities and reduced consumer spending have influenced the adoption of MID in various industries. Adaptation to remote work and changes in consumer behavior have also influenced market dynamics, requiring strategic adjustments from industry players.
The laser direct structuring (LDS) segment is expected to be the largest during the forecast period
The laser direct structuring (LDS) segment is projected to be the largest in the forecast period due to its advanced capabilities in molded interconnect device (MID) manufacturing. LDS technology enables precise and intricate circuit patterns by selectively activating additives in the molded substrate using laser beams. This method offers high flexibility and design complexity, making it increasingly favored in diverse applications. The demand for sophisticated electronic devices and the growing trend towards miniaturization contribute to the dominance of the LDS segment in the market.
The sensors segment is expected to have the highest CAGR during the forecast period
The sensors segment is anticipated to exhibit the highest growth rate during the forecast period in the molded interconnect devices (MID) market. This surge is attributed to the escalating demand for compact and integrated sensor solutions across industries. MID technology's ability to seamlessly embed sensors within three-dimensional structures enhances design efficiency and functionality, driving the growing adoption of MID in sensor applications and contributing to the segment's robust growth.
Region with largest share:
North America is poised to lead the molded interconnect devices (MID) market, boasting the largest share during the forecast period. This dominance is attributed to a robust electronics industry, technological innovation and widespread adoption across sectors like automotive, healthcare and telecommunications. Favorable economic conditions, a well-established manufacturing infrastructure and a proactive approach towards advanced technologies contribute to the region's prominence. The continuous demand for compact and multifunctional electronic solutions further propels the growth of the MID market in North America.
Region with highest CAGR:
The Asia-Pacific region is poised for rapid growth in the molded interconnect devices (MID) market due to its burgeoning electronics manufacturing sector, increasing adoption of advanced technologies and expanding consumer electronics markets. The region benefits from a robust supply chain, cost-effective manufacturing capabilities and a rising demand for compact and integrated electronic solutions. With supportive government initiatives and a flourishing innovation ecosystem, Asia-Pacific is becoming a focal point for MID applications, contributing to the anticipated swift expansion of the market.
Key players in the market
Some of the key players in Molded Interconnect Devices (MID) market include Amphenol Corporation, Cicor Group, Galtronics USA Inc. (Baylin Technologies), Harting Technology Group, Kübler Group, LP Technologies, Inc., LPKF Laser & Electronics AG, MacDermid Alpha Electronics Solutions, MID Solutions, Inc., Molex LLC, Multiple Dimensions AG, RTP Company, Taoglas, TE Connectivity Ltd., T-Ink Inc. and Yomura Technologies Inc.
Key Developments:
In November 2023, Molex has built a new medical device campus in Poland in a $110m project that adds high power busbar and battery interconnect for its electrification business. The new Molex facility Katowice, Poland, has an initial 23,000 square-meter manufacturing space for advanced medical devices for Phillips-Medisize as well as electric vehicle and electrification interconnect for Molex customers. The site will have advanced medical device assembly, packaging and injection molding and also manufacture interconnect battery solutions for electric vehicles and high-power busbar solutions for Molex’s electrification business.
In May 2022, Taoglas has signed a partnership agreement with Dejerao. The company will help Dejerao’s customers by providing best-in-class RF antennas for cellular bonding devices used in mobile applications.
In March 2022, Amphenol Corporation has expanded its SURLOK Plus Series to include 8 mm and 10.3 mm right-angle connectors, with a voltage range of 1500 VDC to meet energy storage and high-power connection and transfer requirements.
Product Types Covered:
• Antenna & Connectivity Modules
• Connectors & Switches
• Lighting Systems
• Sensors
• Other Product Types
Processes Covered:
• Laser Direct Structuring (LDS)
• Film Techniques
• Two-Shot Molding
End Users Covered:
• Telecommunications
• Automotive
• Consumer Electronics
• Industrial
• Medical
• Military & Aerospace
• Other End Users
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Table of Contents
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Product Analysis
3.7 End User Analysis
3.8 Impact of Covid-19
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Molded Interconnect Devices (MID) Market, By Product Type
5.1 Introduction
5.2 Antenna & Connectivity Modules
5.3 Connectors & Switches
5.4 Lighting Systems
5.5 Sensors
5.6 Other Product Types
6 Global Molded Interconnect Devices (MID) Market, By Process
6.1 Introduction
6.2 Laser Direct Structuring (LDS)
6.3 Film Techniques
6.4 Two-Shot Molding
7 Global Molded Interconnect Devices (MID) Market, By End User
7.1 Introduction
7.2 Telecommunications
7.3 Automotive
7.4 Consumer Electronics
7.5 Industrial
7.6 Medical
7.7 Military & Aerospace
7.8 Other End Users
8 Global Molded Interconnect Devices (MID) Market, By Geography
8.1 Introduction
8.2 North America
8.2.1 US
8.2.2 Canada
8.2.3 Mexico
8.3 Europe
8.3.1 Germany
8.3.2 UK
8.3.3 Italy
8.3.4 France
8.3.5 Spain
8.3.6 Rest of Europe
8.4 Asia Pacific
8.4.1 Japan
8.4.2 China
8.4.3 India
8.4.4 Australia
8.4.5 New Zealand
8.4.6 South Korea
8.4.7 Rest of Asia Pacific
8.5 South America
8.5.1 Argentina
8.5.2 Brazil
8.5.3 Chile
8.5.4 Rest of South America
8.6 Middle East & Africa
8.6.1 Saudi Arabia
8.6.2 UAE
8.6.3 Qatar
8.6.4 South Africa
8.6.5 Rest of Middle East & Africa
9 Key Developments
9.1 Agreements, Partnerships, Collaborations and Joint Ventures
9.2 Acquisitions & Mergers
9.3 New Product Launch
9.4 Expansions
9.5 Other Key Strategies
10 Company Profiling
10.1 Amphenol Corporation
10.2 Cicor Group
10.3 Galtronics USA Inc. (Baylin Technologies)
10.4 Harting Technology Group
10.5 Kübler Group
10.6 LP Technologies, Inc.
10.7 LPKF Laser & Electronics AG
10.8 MacDermid Alpha Electronics Solutions
10.9 MID Solutions, Inc.
10.10 Molex LLC
10.11 Multiple Dimensions AG
10.12 RTP Company
10.13 Taoglas
10.14 TE Connectivity Ltd.
10.15 T-Ink Inc.
10.16 Yomura Technologies Inc.
List of Tables
1 Global Molded Interconnect Devices (MID) Market Outlook, By Region (2021-2030) ($MN)
2 Global Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
3 Global Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
4 Global Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
5 Global Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
6 Global Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
7 Global Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
8 Global Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
9 Global Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
10 Global Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
11 Global Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
12 Global Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
13 Global Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
14 Global Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
15 Global Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
16 Global Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
17 Global Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
18 Global Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
19 Global Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
20 North America Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
21 North America Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
22 North America Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
23 North America Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
24 North America Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
25 North America Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
26 North America Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
27 North America Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
28 North America Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
29 North America Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
30 North America Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
31 North America Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
32 North America Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
33 North America Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
34 North America Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
35 North America Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
36 North America Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
37 North America Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
38 North America Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
39 Europe Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
40 Europe Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
41 Europe Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
42 Europe Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
43 Europe Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
44 Europe Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
45 Europe Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
46 Europe Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
47 Europe Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
48 Europe Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
49 Europe Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
50 Europe Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
51 Europe Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
52 Europe Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
53 Europe Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
54 Europe Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
55 Europe Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
56 Europe Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
57 Europe Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
58 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
59 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
60 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
61 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
62 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
63 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
64 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
65 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
66 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
67 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
68 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
69 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
70 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
71 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
72 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
73 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
74 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
75 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
76 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
77 South America Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
78 South America Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
79 South America Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
80 South America Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
81 South America Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
82 South America Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
83 South America Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
84 South America Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
85 South America Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
86 South America Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
87 South America Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
88 South America Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
89 South America Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
90 South America Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
91 South America Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
92 South America Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
93 South America Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
94 South America Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
95 South America Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
96 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
97 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
98 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
99 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
100 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
101 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
102 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
103 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
104 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
105 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
106 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
107 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
108 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
109 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
110 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
111 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
112 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
113 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
114 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
List of Figures
RESEARCH METHODOLOGY
We at ‘Stratistics’ opt for an extensive research approach which involves data mining, data validation, and data analysis. The various research sources include in-house repository, secondary research, competitor’s sources, social media research, client internal data, and primary research.
Our team of analysts prefers the most reliable and authenticated data sources in order to perform the comprehensive literature search. With access to most of the authenticated data bases our team highly considers the best mix of information through various sources to obtain extensive and accurate analysis.
Each report takes an average time of a month and a team of 4 industry analysts. The time may vary depending on the scope and data availability of the desired market report. The various parameters used in the market assessment are standardized in order to enhance the data accuracy.
Data Mining
The data is collected from several authenticated, reliable, paid and unpaid sources and is filtered depending on the scope & objective of the research. Our reports repository acts as an added advantage in this procedure. Data gathering from the raw material suppliers, distributors and the manufacturers is performed on a regular basis, this helps in the comprehensive understanding of the products value chain. Apart from the above mentioned sources the data is also collected from the industry consultants to ensure the objective of the study is in the right direction.
Market trends such as technological advancements, regulatory affairs, market dynamics (Drivers, Restraints, Opportunities and Challenges) are obtained from scientific journals, market related national & international associations and organizations.
Data Analysis
From the data that is collected depending on the scope & objective of the research the data is subjected for the analysis. The critical steps that we follow for the data analysis include:
- Product Lifecycle Analysis
- Competitor analysis
- Risk analysis
- Porters Analysis
- PESTEL Analysis
- SWOT Analysis
The data engineering is performed by the core industry experts considering both the Marketing Mix Modeling and the Demand Forecasting. The marketing mix modeling makes use of multiple-regression techniques to predict the optimal mix of marketing variables. Regression factor is based on a number of variables and how they relate to an outcome such as sales or profits.
Data Validation
The data validation is performed by the exhaustive primary research from the expert interviews. This includes telephonic interviews, focus groups, face to face interviews, and questionnaires to validate our research from all aspects. The industry experts we approach come from the leading firms, involved in the supply chain ranging from the suppliers, distributors to the manufacturers and consumers so as to ensure an unbiased analysis.
We are in touch with more than 15,000 industry experts with the right mix of consultants, CEO's, presidents, vice presidents, managers, experts from both supply side and demand side, executives and so on.
The data validation involves the primary research from the industry experts belonging to:
- Leading Companies
- Suppliers & Distributors
- Manufacturers
- Consumers
- Industry/Strategic Consultants
Apart from the data validation the primary research also helps in performing the fill gap research, i.e. providing solutions for the unmet needs of the research which helps in enhancing the reports quality.
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