Redistribution Layer Material Market
Redistribution Layer Material Market Forecasts to 2030 - Global Analysis By Type (Fan-out wafer-level packaging (FOWLP), 5D/3D Integrated Circuit (IC) Packaging and Other Types), Material Type (Benzocylobutene, Polyimide, Polybenzoxazole and Other Material Types), Application, and By Geography
|
Years Covered |
2021-2030 |
|
Estimated Year Value (2023) |
US $218.36 MN |
|
Projected Year Value (2030) |
US $529.85 MN |
|
CAGR (2023 - 2030) |
13.5% |
|
Regions Covered |
North America, Europe, Asia Pacific, South America, and Middle East & Africa |
|
Countries Covered |
US, Canada, Mexico, Germany, UK, Italy, France, Spain, Japan, China, India, Australia, New Zealand, South Korea, Rest of Asia Pacific, South America, Argentina, Brazil, Chile, Middle East & Africa, Saudi Arabia, UAE, Qatar, and South Africa |
|
Largest Market |
Asia Pacific |
|
Highest Growing Market |
Europe |
According to Stratistics MRC, the Global Redistribution Layer Material Market is accounted for $218.36 million in 2023 and is expected to reach $529.85 million by 2030 growing at a CAGR of 13.5% during the forecast period. A redistribution layer material (RLM) is a crucial component in electronic devices, facilitating efficient energy or signal distribution. It serves as a bridge between different layers of a chip, enabling efficient interconnection and signal distribution. RDL materials often need to be compatible with advanced packaging processes, such as flip-chip bonding or through-silicon via (TSV) technology. RDL materials possess favorable thermal conductivity characteristics to dissipate heat generated during operation, ensuring the reliability and longevity of the semiconductor device, particularly in the context of emerging technologies and miniaturization trends in the semiconductor industry.
According to the ISEAS-Yusof Ishak Institute, Southeast Asia is an important automobile production base and seventh largest automotive manufacturing hub worldwide and produced 3.5 million vehicles in 2021.
Market Dynamics:
Driver:
Rising complexity in integrated circuits
Integrated circuits are becoming more intricate, incorporating a greater number of components and functionalities within a limited space. These materials provide efficient interconnection solutions, minimize signal losses, and enhance thermal management within the confined spaces of advanced semiconductor devices. In addition, RDL materials contribute to the reliability and performance of integrated circuits, thereby boosting market growth.
Restraint:
High costs
The complexity of developing RDL materials with precise properties, such as high electrical and thermal conductivity, adds to the cost challenge. These sophisticated processes contribute to elevated production costs, impacting the overall affordability of semiconductor devices. Furthermore, the demand for cost-effective solutions in a competitive market intensifies the pressure on manufacturers to optimize production expenses. High material costs can lead to increased end-product prices, limiting market accessibility and adoption.
Opportunity:
Advanced packaging technologies
The demand for compact and high-performance packaging solutions has intensified as electronic devices become increasingly sophisticated. These packaging innovations are crucial for meeting the demands of modern electronic applications, ranging from mobile devices to complex computing systems. Moreover, it facilitates the integration of multiple functions on a single chip, enhances performance, and enables the creation of smaller, more powerful devices, which is driving this market expansion.
Threat:
Limited standardization
The absence of standardized testing methods and benchmarks makes it challenging for stakeholders to assess and compare the performance of different RDL materials accurately. This lack of common ground hinders interoperability and interchangeability, leading to complications in the integration of RDL materials into diverse semiconductor devices. It also increases the complexity of supply chain management for manufacturers, which is impeding this market size.
Covid-19 Impact
The COVID-19 pandemic has significantly impacted the market, causing disruptions in the supply chain and influencing market dynamics. Many manufacturers faced difficulties in sourcing raw materials, leading to increased prices and a strain on profit margins. Moreover, the shift towards remote working and reduced consumer spending on non-essential electronics further dampened the market's performance.
The 5D/3D integrated circuit (IC) Packaging segment is expected to be the largest during the forecast period
The 5D/3D integrated circuit (IC) Packaging segment is estimated to hold the largest share, due to the integration of multiple layers of ICs in three dimensions, enhancing performance and functionality. A paradigm shift towards materials offer improved thermal conductivity, electrical performance, and reliability. Moreover, as 5D/3D IC packaging enables the stacking of multiple semiconductor layers, RDL materials play a critical role in facilitating interconnects and signal distribution within these complex structures which is driving this segment growth.
The benzocylobutene segment is expected to have the highest CAGR during the forecast period
The benzocylobutene segment is anticipated to have highest CAGR during the forecast period, particularly in the realm of advanced microelectronics and semiconductor packaging. BCB, a high-performance polymer, serves as a crucial material for the fabrication of RDLs in integrated circuits. Furthermore, unique properties, including excellent thermal stability, a low dielectric constant, and superior planarization capabilities, make it an ideal choice for RDL applications, which are boosting this segment’s growth.
Region with largest share:
Asia Pacific commanded the largest market share during the extrapolated period, owing to a rapidly expanding consumer electronics, telecommunications, and automotive electronics. Countries such as China, Japan, South Korea, and Taiwan are at the forefront of this market, hosting major semiconductor manufacturers and assembly facilities. In addition, as electronic devices become more sophisticated and compact, the need for efficient RDL materials becomes critical for ensuring high-performance integrated circuits, driving the size of this region.
Region with highest CAGR:
Europe is expected to witness highest CAGR over the projection period, owing to advancements in semiconductor packaging and microelectronics. The region is home to several key players, including Infineon Technologies, Hitachi Chemical, DuPont MicroSystems L.L.C., and Amkor Technology, which host major manufacturing and research facilities. Moreover, government initiatives promoting innovation, coupled with a strong emphasis on quality and precision engineering, are propelling this region’s expansion.
Key players in the market
Some of the key players in the Redistribution Layer Material Market include Fujifilm Corporation, HD MicroSystems LLC, NXP Semiconductors, ASE Group, Infineon Technologies, Samsung Electronics Co., Ltd., Amkor Technology, SK Hynix Inc., Shin-Etsu Chemical Co., Ltd and Jiangsu Changjiang Electronics Technology Co., Ltd.
Key Developments:
In November 2023, Amkor Technology, Inc. announced that it has committed to setting targets to reduce greenhouse gas emissions in alignment with the Science Based Targets initiative (SBTi).
In June 2023, FUJIFILM Cellular Dynamics, announces the global commercial launch of its human iPSC-derived iCell® Blood-Brain Barrier Isogenic Kit for scientists engaged in neuroscience research and drug discovery for neuroactive drugs.
In January 2023, FUJIFILM Cellular Dynamics, Inc., announced that it has entered an agreement to grant global healthcare company Novo Nordisk A/S a non-exclusive right to use FUJIFILM Cellular Dynamics’ iPSC platform for the development and commercialization of iPSC-derived cell therapies with a focus on addressing serious chronic diseases
Types Covered:
• Fan-out wafer-level packaging (FOWLP)
• 5D/3D Integrated Circuit (IC) Packaging
• Other Types
Material Types Covered:
• Benzocylobutene
• Polyimide
• Polybenzoxazole
• Other Material Types
Applications Covered:
• Chemical Industry
• Electronic Appliances
• Other Applications
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Table of Contents
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Application Analysis
3.7 Emerging Markets
3.8 Impact of Covid-19
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Redistribution Layer Material Market, By Type
5.1 Introduction
5.2 Fan-out wafer-level packaging (FOWLP)
5.3 5D/3D Integrated Circuit (IC) Packaging
5.4 Other Types
6 Global Redistribution Layer Material Market, By Material Type
6.1 Introduction
6.2 Benzocylobutene
6.3 Polyimide
6.4 Polybenzoxazole
6.5 Other Material Types
7 Global Redistribution Layer Material Market, By Application
7.1 Introduction
7.2 Chemical Industry
7.3 Electronic Appliances
7.4 Other Applications
8 Global Redistribution Layer Material Market, By Geography
8.1 Introduction
8.2 North America
8.2.1 US
8.2.2 Canada
8.2.3 Mexico
8.3 Europe
8.3.1 Germany
8.3.2 UK
8.3.3 Italy
8.3.4 France
8.3.5 Spain
8.3.6 Rest of Europe
8.4 Asia Pacific
8.4.1 Japan
8.4.2 China
8.4.3 India
8.4.4 Australia
8.4.5 New Zealand
8.4.6 South Korea
8.4.7 Rest of Asia Pacific
8.5 South America
8.5.1 Argentina
8.5.2 Brazil
8.5.3 Chile
8.5.4 Rest of South America
8.6 Middle East & Africa
8.6.1 Saudi Arabia
8.6.2 UAE
8.6.3 Qatar
8.6.4 South Africa
8.6.5 Rest of Middle East & Africa
9 Key Developments
9.1 Agreements, Partnerships, Collaborations and Joint Ventures
9.2 Acquisitions & Mergers
9.3 New Product Launch
9.4 Expansions
9.5 Other Key Strategies
10 Company Profiling
10.1 Fujifilm Corporation
10.2 HD MicroSystems LLC
10.3 NXP Semiconductors.
10.4 ASE Group
10.5 Infineon Technologies
10.6 Samsung Electronics Co., Ltd.
10.7 Amkor Technology
10.8 SK Hynix Inc.
10.9 Shin-Etsu Chemical Co., Ltd
10.10 Jiangsu Changjiang Electronics Technology Co., Ltd.
List of Tables
1 Global Redistribution Layer Material Market Outlook, By Region (2021-2030) ($MN)
2 Global Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
3 Global Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
4 Global Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
5 Global Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
6 Global Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
7 Global Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
8 Global Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
9 Global Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
10 Global Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
11 Global Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
12 Global Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
13 Global Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
14 Global Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
15 North America Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
16 North America Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
17 North America Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
18 North America Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
19 North America Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
20 North America Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
21 North America Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
22 North America Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
23 North America Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
24 North America Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
25 North America Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
26 North America Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
27 North America Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
28 North America Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
29 Europe Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
30 Europe Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
31 Europe Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
32 Europe Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
33 Europe Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
34 Europe Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
35 Europe Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
36 Europe Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
37 Europe Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
38 Europe Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
39 Europe Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
40 Europe Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
41 Europe Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
42 Europe Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
43 Asia Pacific Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
44 Asia Pacific Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
45 Asia Pacific Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
46 Asia Pacific Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
47 Asia Pacific Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
48 Asia Pacific Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
49 Asia Pacific Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
50 Asia Pacific Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
51 Asia Pacific Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
52 Asia Pacific Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
53 Asia Pacific Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
54 Asia Pacific Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
55 Asia Pacific Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
56 Asia Pacific Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
57 South America Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
58 South America Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
59 South America Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
60 South America Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
61 South America Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
62 South America Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
63 South America Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
64 South America Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
65 South America Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
66 South America Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
67 South America Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
68 South America Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
69 South America Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
70 South America Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
71 Middle East & Africa Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
72 Middle East & Africa Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
73 Middle East & Africa Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
74 Middle East & Africa Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
75 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
76 Middle East & Africa Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
77 Middle East & Africa Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
78 Middle East & Africa Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
79 Middle East & Africa Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
80 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
81 Middle East & Africa Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
82 Middle East & Africa Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
83 Middle East & Africa Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
84 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
List of Figures
RESEARCH METHODOLOGY
We at ‘Stratistics’ opt for an extensive research approach which involves data mining, data validation, and data analysis. The various research sources include in-house repository, secondary research, competitor’s sources, social media research, client internal data, and primary research.
Our team of analysts prefers the most reliable and authenticated data sources in order to perform the comprehensive literature search. With access to most of the authenticated data bases our team highly considers the best mix of information through various sources to obtain extensive and accurate analysis.
Each report takes an average time of a month and a team of 4 industry analysts. The time may vary depending on the scope and data availability of the desired market report. The various parameters used in the market assessment are standardized in order to enhance the data accuracy.
Data Mining
The data is collected from several authenticated, reliable, paid and unpaid sources and is filtered depending on the scope & objective of the research. Our reports repository acts as an added advantage in this procedure. Data gathering from the raw material suppliers, distributors and the manufacturers is performed on a regular basis, this helps in the comprehensive understanding of the products value chain. Apart from the above mentioned sources the data is also collected from the industry consultants to ensure the objective of the study is in the right direction.
Market trends such as technological advancements, regulatory affairs, market dynamics (Drivers, Restraints, Opportunities and Challenges) are obtained from scientific journals, market related national & international associations and organizations.
Data Analysis
From the data that is collected depending on the scope & objective of the research the data is subjected for the analysis. The critical steps that we follow for the data analysis include:
- Product Lifecycle Analysis
- Competitor analysis
- Risk analysis
- Porters Analysis
- PESTEL Analysis
- SWOT Analysis
The data engineering is performed by the core industry experts considering both the Marketing Mix Modeling and the Demand Forecasting. The marketing mix modeling makes use of multiple-regression techniques to predict the optimal mix of marketing variables. Regression factor is based on a number of variables and how they relate to an outcome such as sales or profits.
Data Validation
The data validation is performed by the exhaustive primary research from the expert interviews. This includes telephonic interviews, focus groups, face to face interviews, and questionnaires to validate our research from all aspects. The industry experts we approach come from the leading firms, involved in the supply chain ranging from the suppliers, distributors to the manufacturers and consumers so as to ensure an unbiased analysis.
We are in touch with more than 15,000 industry experts with the right mix of consultants, CEO's, presidents, vice presidents, managers, experts from both supply side and demand side, executives and so on.
The data validation involves the primary research from the industry experts belonging to:
- Leading Companies
- Suppliers & Distributors
- Manufacturers
- Consumers
- Industry/Strategic Consultants
Apart from the data validation the primary research also helps in performing the fill gap research, i.e. providing solutions for the unmet needs of the research which helps in enhancing the reports quality.
For more details about research methodology, kindly write to us at info@strategymrc.com
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