Semiconductor Fabrication Material - Global Market Outlook (2019-2027)
According to Stratistics MRC, the Global Semiconductor Fabrication Material Market is accounted for $27.55 billion in 2019 and is expected to reach $43.57 billion by 2027 growing at a CAGR of 5.9% during the forecast period. Growing demand for CPM slurry in consumer electronic devices and rising demand for high-performance devices with improved speed and capacity are some of the factors driving the growth of the market. However, the volatile price of raw materials is hindering the growth of the market.
Semiconductor fabrication materials are materials used to pattern the wafer of the semiconductor. The semiconductor fabrication process is utilized for the making of integrated circuits on the semiconductor. Electric current is transferred through these integrated circuits.
Based on the material type, the silicon wafers segment is anticipated to hold considerable market share during the forecast period due to the growing demand for semiconductor ICs and investments being made by key vendors for expanding their fabrication facilities. By geography, Asia Pacific is going to have a lucrative growth during the forecast period owing to the presence of leading semiconductor foundries and an increase in the investments by semiconductor companies.
Some of the key players profiled in the Semiconductor Fabrication Material Market include Air Products and Chemicals Inc., Praxair, Inc., Linde AG, Kanto Chemical Co., Inc., JSR Corporation, Dow Chemical Company, BASF SE, Alent Plc, Taiyo Nippon Sanso, Air Liquide SA, Cabot Microelectronics Corp., Hemlock Semiconductor Corporation, E. I. du Pont de Nemours and Company, Hitachi High-Technologies Corporation, Avantor Performance Materials Inc., and Honeywell International Inc.
• Silicon Material
• Indium Gallium Zinc Oxide
• Gallium Arsenide (GaAs)
Semiconductor Types Covered:
Material Types Covered:
• Wet Chemicals
• Silicon Wafers
• Sputter Targets
• Chemical Mechanical Polishing (CMP) Slurry & Pads
• Photoresist Ancillaries
Packing Materials Covered:
• Mold Compounds
• Die Attach
• Ceramic Packages
• Bonding Wire
End Users Covered:
• Power Generation
• Defense & Aerospace
• Consumer Goods
• Electricals and Electronics
• North America
o Rest of Europe
• Asia Pacific
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o South Africa
o Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
o Benchmarking of key players based on product portfolio, geographical presence, and strategic alliance
Select License Type
Best in class reports with high standard of research integrity
24X7 Research Support
Continuous support to ensure the best customer experience.
Adding more values to your product of interest.
Safe & Secure Access
Providing a secured environment for all online transactions.
Trusted by 600+ Brands
Serving the most reputed brands across the world.