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Underfill Market

Underfill - Global Market Outlook (2018-2027)

4.4 (43 reviews)
Published: April 2020 ID: SMRC19025
4.4 (43 reviews)
Published: April 2020 ID: SMRC19025

This report covers the impact of COVID-19 on this global market

According to Stratistics MRC, the Global Underfill Market is accounted for $240.34 million in 2018 and is expected to reach $600.00 million by 2027 growing at a CAGR of 10.7% during the forecast period. Some of the key factors propelling the market growth are increasing demand for low cost, high performing, small in size devices, rising demand in smart phones and tablets, increasing use of underfill material, and increasing demand for portable systems in aerospace and military. However, reducing profit margins of underfill suppliers is restricting the market growth.

Underfill materials are composite formulations of organic polymers and inorganic fillers which are used in semiconductor packaging to achieve improved thermo mechanical performance. molded underfill (MUF), capillary underfill (CUF) and no flow underfill (NUF) are some techniques which are used in underfill materials.

By product type, capillary underfill material (CUF) is anticipated to grow at the significant rate during the forecast period, due to high cost, recent developments in the electronic industry. It is used in several packaging techniques which include ball grid array, chip scale packaging, flip chip, and others. Due to growing pricing pressure from end use industry, CUF being a conventional and relatively costly technique is replaced by MUF process technique.

Based on the geography, Asia Pacific region is expected to have considerable market growth during the forecast period, due to high adoption of underfill materials in various industries in China. Most successful semiconductor and electronics producers have established their business in countries of Asia Pacific. In China, the high-end underfill products mainly rely on import from foreign developed countries. To meet the large demand for the high-end products, Chinese manufacturers will invest much more on the R&D, which will certainly weaken the dependence of imports.

Some of the key players in underfill market include Master Bond, DOVER, Hitachi Chemical, AIM Solder, SUNSTAR, NAMICS Corporation, Zymet, Fuji, WON CHEMICAL, Shin-Etsu Chemical, HIGHTITE, Panacol-Elosol, U-bond, Darbond, Henkel AG & Co. KGaA, Bondline, Epoxy Technology Inc., Nordson Corporation, H.B Fuller, and Panasonic Corporation.
 
Product Types Covered:
• Molded Underfill Material (MUF)
• No Flow Underfill Material (NUF)
• Capillary Underfill Material (CUF)
• Semiconductor Underfills
• Board Level Underfills

Applications Covered:
• Chip Scale Packaging (CSP)
• Flip Chips
• Ball Grid Array (BGA)

End Users Covered:
• Consumer Electronics
• Automotive Electronics
• Defense & Aerospace Electronics
• Medical Electronics
• Industrial Electronics

Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o France
o Italy
o UK 
o Spain
o Rest of Europe      
• Asia Pacific
o Japan       
o China       
o India       
o Australia       
o New Zealand      
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2017, 2018, 2019, 2023 and 2027
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter’s five forces analysis, SWOT analysis, etc.
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements

Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
o Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

1 Executive Summary      
       
2 Preface  
    
 2.1 Abstract     
 2.2 Stake Holders     
 2.3 Research Scope     
 2.4 Research Methodology     
  2.4.1 Data Mining    
  2.4.2 Data Analysis    
  2.4.3 Data Validation    
  2.4.4 Research Approach    
 2.5 Research Sources     
  2.5.1 Primary Research Sources    
  2.5.2 Secondary Research Sources    
  2.5.3 Assumptions    
       
3 Market Trend Analysis      
 3.1 Introduction     
 3.2 Drivers     
 3.3 Restraints     
 3.4 Opportunities     
 3.5 Threats     
 3.6 Product Analysis     
 3.7 Application Analysis     
 3.8 End User Analysis     
 3.9 Emerging Markets     
 3.10 Impact of Covid-19     
       
4 Porters Five Force Analysis      
 4.1 Bargaining power of suppliers     
 4.2 Bargaining power of buyers     
 4.3 Threat of substitutes     
 4.4 Threat of new entrants     
 4.5 Competitive rivalry     
       
5 Global Underfill Market, By Product Type      
 5.1 Introduction     
 5.2 Molded Underfill Material (MUF)     
 5.3 No Flow Underfill Material (NUF)     
 5.4 Capillary Underfill Material (CUF)     
 5.5 Semiconductor Underfills     
 5.6 Board Level Underfills     
        
6 Global Underfill Market, By Application      
 6.1 Introduction     
 6.2 Chip Scale Packaging (CSP)     
 6.3 Flip Chips     
 6.4 Ball Grid Array (BGA)     
       
7 Global Underfill Market, By End User      
 7.1 Introduction     
 7.2 Consumer Electronics     
  7.2.1 Mobile Phones    
  7.2.2 MP3 Players    
  7.2.3 Laptops    
  7.2.4 Game Consoles    
  7.2.5 Digital Cameras    
 7.3 Automotive Electronics     
 7.4 Defense & Aerospace Electronics     
 7.5 Medical Electronics     
 7.6 Industrial Electronics     
       
8 Global Underfill Market, By Geography      
 8.1 Introduction     
 8.2 North America     
  8.2.1 US    
  8.2.2 Canada    
  8.2.3 Mexico    
 8.3 Europe     
  8.3.1 Germany    
  8.3.2 UK     
  8.3.3 Italy    
  8.3.4 France    
  8.3.5 Spain    
  8.3.6 Rest of Europe    
 8.4 Asia Pacific     
  8.4.1 Japan    
  8.4.2 China    
  8.4.3 India    
  8.4.4 Australia    
  8.4.5 New Zealand    
  8.4.6 South Korea    
  8.4.7 Rest of Asia Pacific    
 8.5 South America     
  8.5.1 Argentina    
  8.5.2 Brazil    
  8.5.3 Chile    
  8.5.4 Rest of South America    
 8.6 Middle East & Africa     
  8.6.1 Saudi Arabia    
  8.6.2 UAE    
  8.6.3 Qatar    
  8.6.4 South Africa    
  8.6.5 Rest of Middle East & Africa    
       
9 Key Developments      
 9.1 Agreements, Partnerships, Collaborations and Joint Ventures     
 9.2 Acquisitions & Mergers     
 9.3 New Product Launch     
 9.4 Expansions     
 9.5 Other Key Strategies     
       
10 Company Profiling      
 10.1 Master Bond     
 10.2 DOVER     
 10.3 Hitachi Chemical     
 10.4 AIM Solder     
 10.5 SUNSTAR     
 10.6 NAMICS Corporation     
 10.7 Zymet     
 10.8 Fuji     
 10.9 WON CHEMICAL      
 10.10 Shin-Etsu Chemical     
 10.11 HIGHTITE     
 10.12 Panacol-Elosol     
 10.13 U-bond     
 10.14 Darbond     
 10.15 Henkel AG & Co. KGaA     
 10.16 Bondline     
 10.17 Epoxy Technology Inc.     
 10.18 Nordson Corporation     
 10.19 H.B Fuller     
 10.20 Panasonic Corporation    


List of Tables       
1 Global Underfill Market Outlook, By Region (2017-2027) ($MN)      
2 Global Underfill Market Outlook, By Product Type (2017-2027) ($MN)      
3 Global Underfill Market Outlook, By Molded Underfill Material (MUF) (2017-2027) ($MN)      
4 Global Underfill Market Outlook, By No Flow Underfill Material (NUF) (2017-2027) ($MN)      
5 Global Underfill Market Outlook, By Capillary Underfill Material (CUF) (2017-2027) ($MN)      
6 Global Underfill Market Outlook, By Semiconductor Underfills (2017-2027) ($MN)      
7 Global Underfill Market Outlook, By Board Level Underfills (2017-2027) ($MN)      
8 Global Underfill Market Outlook, By Application (2017-2027) ($MN)      
9 Global Underfill Market Outlook, By Chip Scale Packaging (CSP) (2017-2027) ($MN)      
10 Global Underfill Market Outlook, By Flip Chips (2017-2027) ($MN)      
11 Global Underfill Market Outlook, By Ball Grid Array (BGA) (2017-2027) ($MN)      
12 Global Underfill Market Outlook, By End User (2017-2027) ($MN)      
13 Global Underfill Market Outlook, By Consumer Electronics (2017-2027) ($MN)      
14 Global Underfill Market Outlook, By Mobile Phones (2017-2027) ($MN)      
15 Global Underfill Market Outlook, By MP3 Players (2017-2027) ($MN)      
16 Global Underfill Market Outlook, By Laptops (2017-2027) ($MN)      
17 Global Underfill Market Outlook, By Game Consoles (2017-2027) ($MN)      
18 Global Underfill Market Outlook, By Digital Cameras (2017-2027) ($MN)      
19 Global Underfill Market Outlook, By Automotive Electronics (2017-2027) ($MN)      
20 Global Underfill Market Outlook, By Defense & Aerospace Electronics (2017-2027) ($MN)      
21 Global Underfill Market Outlook, By Medical Electronics (2017-2027) ($MN)      
22 Global Underfill Market Outlook, By Industrial Electronics (2017-2027) ($MN)      
23 North America Underfill Market Outlook, By Country (2017-2027) ($MN)      
24 North America Underfill Market Outlook, By Product Type (2017-2027) ($MN)      
25 North America Underfill Market Outlook, By Molded Underfill Material (MUF) (2017-2027) ($MN)      
26 North America Underfill Market Outlook, By No Flow Underfill Material (NUF) (2017-2027) ($MN)      
27 North America Underfill Market Outlook, By Capillary Underfill Material (CUF) (2017-2027) ($MN)      
28 North America Underfill Market Outlook, By Semiconductor Underfills (2017-2027) ($MN)      
29 North America Underfill Market Outlook, By Board Level Underfills (2017-2027) ($MN)      
30 North America Underfill Market Outlook, By Application (2017-2027) ($MN)      
31 North America Underfill Market Outlook, By Chip Scale Packaging (CSP) (2017-2027) ($MN)      
32 North America Underfill Market Outlook, By Flip Chips (2017-2027) ($MN)      
33 North America Underfill Market Outlook, By Ball Grid Array (BGA) (2017-2027) ($MN)      
34 North America Underfill Market Outlook, By End User (2017-2027) ($MN)      
35 North America Underfill Market Outlook, By Consumer Electronics (2017-2027) ($MN)      
36 North America Underfill Market Outlook, By Mobile Phones (2017-2027) ($MN)      
37 North America Underfill Market Outlook, By MP3 Players (2017-2027) ($MN)      
38 North America Underfill Market Outlook, By Laptops (2017-2027) ($MN)      
39 North America Underfill Market Outlook, By Game Consoles (2017-2027) ($MN)      
40 North America Underfill Market Outlook, By Digital Cameras (2017-2027) ($MN)      
41 North America Underfill Market Outlook, By Automotive Electronics (2017-2027) ($MN)      
42 North America Underfill Market Outlook, By Defense & Aerospace Electronics (2017-2027) ($MN)      
43 North America Underfill Market Outlook, By Medical Electronics (2017-2027) ($MN)      
44 North America Underfill Market Outlook, By Industrial Electronics (2017-2027) ($MN)      
45 Europe Underfill Market Outlook, By Country (2017-2027) ($MN)      
46 Europe Underfill Market Outlook, By Product Type (2017-2027) ($MN)      
47 Europe Underfill Market Outlook, By Molded Underfill Material (MUF) (2017-2027) ($MN)      
48 Europe Underfill Market Outlook, By No Flow Underfill Material (NUF) (2017-2027) ($MN)      
49 Europe Underfill Market Outlook, By Capillary Underfill Material (CUF) (2017-2027) ($MN)      
50 Europe Underfill Market Outlook, By Semiconductor Underfills (2017-2027) ($MN)      
51 Europe Underfill Market Outlook, By Board Level Underfills (2017-2027) ($MN)      
52 Europe Underfill Market Outlook, By Application (2017-2027) ($MN)      
53 Europe Underfill Market Outlook, By Chip Scale Packaging (CSP) (2017-2027) ($MN)      
54 Europe Underfill Market Outlook, By Flip Chips (2017-2027) ($MN)      
55 Europe Underfill Market Outlook, By Ball Grid Array (BGA) (2017-2027) ($MN)      
56 Europe Underfill Market Outlook, By End User (2017-2027) ($MN)      
57 Europe Underfill Market Outlook, By Consumer Electronics (2017-2027) ($MN)      
58 Europe Underfill Market Outlook, By Mobile Phones (2017-2027) ($MN)      
59 Europe Underfill Market Outlook, By MP3 Players (2017-2027) ($MN)      
60 Europe Underfill Market Outlook, By Laptops (2017-2027) ($MN)      
61 Europe Underfill Market Outlook, By Game Consoles (2017-2027) ($MN)      
62 Europe Underfill Market Outlook, By Digital Cameras (2017-2027) ($MN)      
63 Europe Underfill Market Outlook, By Automotive Electronics (2017-2027) ($MN)      
64 Europe Underfill Market Outlook, By Defense & Aerospace Electronics (2017-2027) ($MN)      
65 Europe Underfill Market Outlook, By Medical Electronics (2017-2027) ($MN)      
66 Europe Underfill Market Outlook, By Industrial Electronics (2017-2027) ($MN)      
67 Asia Pacific Underfill Market Outlook, By Country (2017-2027) ($MN)      
68 Asia Pacific Underfill Market Outlook, By Product Type (2017-2027) ($MN)      
69 Asia Pacific Underfill Market Outlook, By Molded Underfill Material (MUF) (2017-2027) ($MN)      
70 Asia Pacific Underfill Market Outlook, By No Flow Underfill Material (NUF) (2017-2027) ($MN)      
71 Asia Pacific Underfill Market Outlook, By Capillary Underfill Material (CUF) (2017-2027) ($MN)      
72 Asia Pacific Underfill Market Outlook, By Semiconductor Underfills (2017-2027) ($MN)      
73 Asia Pacific Underfill Market Outlook, By Board Level Underfills (2017-2027) ($MN)      
74 Asia Pacific Underfill Market Outlook, By Application (2017-2027) ($MN)      
75 Asia Pacific Underfill Market Outlook, By Chip Scale Packaging (CSP) (2017-2027) ($MN)      
76 Asia Pacific Underfill Market Outlook, By Flip Chips (2017-2027) ($MN)      
77 Asia Pacific Underfill Market Outlook, By Ball Grid Array (BGA) (2017-2027) ($MN)      
78 Asia Pacific Underfill Market Outlook, By End User (2017-2027) ($MN)      
79 Asia Pacific Underfill Market Outlook, By Consumer Electronics (2017-2027) ($MN)      
80 Asia Pacific Underfill Market Outlook, By Mobile Phones (2017-2027) ($MN)      
81 Asia Pacific Underfill Market Outlook, By MP3 Players (2017-2027) ($MN)      
82 Asia Pacific Underfill Market Outlook, By Laptops (2017-2027) ($MN)      
83 Asia Pacific Underfill Market Outlook, By Game Consoles (2017-2027) ($MN)      
84 Asia Pacific Underfill Market Outlook, By Digital Cameras (2017-2027) ($MN)      
85 Asia Pacific Underfill Market Outlook, By Automotive Electronics (2017-2027) ($MN)      
86 Asia Pacific Underfill Market Outlook, By Defense & Aerospace Electronics (2017-2027) ($MN)      
87 Asia Pacific Underfill Market Outlook, By Medical Electronics (2017-2027) ($MN)      
88 Asia Pacific Underfill Market Outlook, By Industrial Electronics (2017-2027) ($MN)      
89 South America Underfill Market Outlook, By Country (2017-2027) ($MN)      
90 South America Underfill Market Outlook, By Product Type (2017-2027) ($MN)      
91 South America Underfill Market Outlook, By Molded Underfill Material (MUF) (2017-2027) ($MN)      
92 South America Underfill Market Outlook, By No Flow Underfill Material (NUF) (2017-2027) ($MN)      
93 South America Underfill Market Outlook, By Capillary Underfill Material (CUF) (2017-2027) ($MN)      
94 South America Underfill Market Outlook, By Semiconductor Underfills (2017-2027) ($MN)      
95 South America Underfill Market Outlook, By Board Level Underfills (2017-2027) ($MN)      
96 South America Underfill Market Outlook, By Application (2017-2027) ($MN)      
97 South America Underfill Market Outlook, By Chip Scale Packaging (CSP) (2017-2027) ($MN)      
98 South America Underfill Market Outlook, By Flip Chips (2017-2027) ($MN)      
99 South America Underfill Market Outlook, By Ball Grid Array (BGA) (2017-2027) ($MN)      
100 South America Underfill Market Outlook, By End User (2017-2027) ($MN)      
101 South America Underfill Market Outlook, By Consumer Electronics (2017-2027) ($MN)      
102 South America Underfill Market Outlook, By Mobile Phones (2017-2027) ($MN)      
103 South America Underfill Market Outlook, By MP3 Players (2017-2027) ($MN)      
104 South America Underfill Market Outlook, By Laptops (2017-2027) ($MN)      
105 South America Underfill Market Outlook, By Game Consoles (2017-2027) ($MN)      
106 South America Underfill Market Outlook, By Digital Cameras (2017-2027) ($MN)      
107 South America Underfill Market Outlook, By Automotive Electronics (2017-2027) ($MN)      
108 South America Underfill Market Outlook, By Defense & Aerospace Electronics (2017-2027) ($MN)      
109 South America Underfill Market Outlook, By Medical Electronics (2017-2027) ($MN)      
110 South America Underfill Market Outlook, By Industrial Electronics (2017-2027) ($MN)       
111 Middle East & Africa Underfill Market Outlook, By Country (2017-2027) ($MN)      
112 Middle East & Africa Underfill Market Outlook, By Product Type (2017-2027) ($MN)      
113 Middle East & Africa Underfill Market Outlook, By Molded Underfill Material (MUF) (2017-2027) ($MN)      
114 Middle East & Africa Underfill Market Outlook, By No Flow Underfill Material (NUF) (2017-2027) ($MN)      
115 Middle East & Africa Underfill Market Outlook, By Capillary Underfill Material (CUF) (2017-2027) ($MN)       
116 Middle East & Africa Underfill Market Outlook, By Semiconductor Underfills (2017-2027) ($MN)      
117 Middle East & Africa Underfill Market Outlook, By Board Level Underfills (2017-2027) ($MN)      
118 Middle East & Africa Underfill Market Outlook, By Application (2017-2027) ($MN)      
119 Middle East & Africa Underfill Market Outlook, By Chip Scale Packaging (CSP) (2017-2027) ($MN)      
120 Middle East & Africa Underfill Market Outlook, By Flip Chips (2017-2027) ($MN)      
121 Middle East & Africa Underfill Market Outlook, By Ball Grid Array (BGA) (2017-2027) ($MN)      
122 Middle East & Africa Underfill Market Outlook, By End User (2017-2027) ($MN)      
123 Middle East & Africa Underfill Market Outlook, By Consumer Electronics (2017-2027) ($MN)      
124 Middle East & Africa Underfill Market Outlook, By Mobile Phones (2017-2027) ($MN)      
125 Middle East & Africa Underfill Market Outlook, By MP3 Players (2017-2027) ($MN)      
126 Middle East & Africa Underfill Market Outlook, By Laptops (2017-2027) ($MN)      
127 Middle East & Africa Underfill Market Outlook, By Game Consoles (2017-2027) ($MN)      
128 Middle East & Africa Underfill Market Outlook, By Digital Cameras (2017-2027) ($MN)      
129 Middle East & Africa Underfill Market Outlook, By Automotive Electronics (2017-2027) ($MN)      
130 Middle East & Africa Underfill Market Outlook, By Defense & Aerospace Electronics (2017-2027) ($MN)      
131 Middle East & Africa Underfill Market Outlook, By Medical Electronics (2017-2027) ($MN)      
132 Middle East & Africa Underfill Market Outlook, By Industrial Electronics (2017-2027) ($MN)      

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