Underfill Material Market
Underfill Material - Global Market Outlook (2017-2026)
According to Stratistics MRC, the Global Underfill Material Market is accounted for $240.56 million in 2017 and is expected to reach $535.56 million by 2026 growing at a CAGR of 9.3% during the forecast period. Rising demand in automotive and military industries is the major key factors driving the market growth. Moreover, flip chip packaging of low-k devices is providing opportunities for the market growth. However, reducing profit margins of underfill suppliers may restrain the market growth.
Underfill materials are fused formulations of inorganic fillers and organic polymers which can be used as a semiconductor packaging to attain better quality of thermo-mechanical presentation. Molded underfill (MUF), Capillary underfill (CUF) and no flow underfill (NUF) are some techniques which are used in underfill materials.
By Product, Capillary Underfill Material (CUF) held considerable growth during forecast period due recent developments in the electronic industry. It is used in several packaging techniques which include ball grid array, chip scale packaging, flip chip, and others. By geography, Asia Pacific commanded considerable market share attributed to high adoption of these underfill materials in various industries in China.
Some of the key players profiled in the Underfill materials include H.B Fuller, Zymet, Yincae, Advanced Material, Nordson Corporation, Henkel, Master Bond, Epoxy Technology, NAMICS Corporation and Finetech.
Products Covered:
• No Flow Underfill Material (NUF)
• Capillary Underfill Material (CUF)
• Molded Underfill Material (MUF)
Applications Covered:
• Chip Scale Packaging (CSP)
• Ball Grid Array (BGA)
• Flip Chips
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country level segments
- Market share analysis of the top industry players
- Strategic recommendations for the new entrants
- Market forecasts for a minimum of 9 years of all the mentioned segments, sub segments and the regional markets
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the clients interest (Note: Depends of feasibility check)
• Competitive Benchmarking
Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances.
Table of Contents
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Product Analysis
3.7 Application Analysis
3.8 Emerging Markets
3.9 Futuristic Market Scenario
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Underfill Material Market, By Product
5.1 Introduction
5.2 No Flow Underfill Material (NUF)
5.3 Capillary Underfill Material (CUF)
5.4 Molded Underfill Material (MUF)
6 Global Underfill Material Market, By Application
6.1 Introduction
6.2 Chip Scale Packaging (CSP)
6.3 Ball Grid Array (BGA)
6.4 Flip Chips
7 Global Underfill Material Market, By Geography
7.1 Introduction
7.2 North America
7.2.1 US
7.2.2 Canada
7.2.3 Mexico
7.3 Europe
7.3.1 Germany
7.3.2 UK
7.3.3 Italy
7.3.4 France
7.3.5 Spain
7.3.6 Rest of Europe
7.4 Asia Pacific
7.4.1 Japan
7.4.2 China
7.4.3 India
7.4.4 Australia
7.4.5 New Zealand
7.4.6 South Korea
7.4.7 Rest of Asia Pacific
7.5 South America
7.5.1 Argentina
7.5.2 Brazil
7.5.3 Chile
7.5.4 Rest of South America
7.6 Middle East & Africa
7.6.1 Saudi Arabia
7.6.2 UAE
7.6.3 Qatar
7.6.4 South Africa
7.6.5 Rest of Middle East & Africa
8 Key Developments
8.1 Agreements, Partnerships, Collaborations and Joint Ventures
8.2 Acquisitions & Mergers
8.3 New Product Launch
8.4 Expansions
8.5 Other Key Strategies
9 Company Profiling
9.1 H.B Fuller
9.2 Zymet
9.3 Yincae Advanced Material
9.4 Nordson Corporation
9.5 Henkel
9.6 Master Bond
9.7 Epoxy Technology
9.8 NAMICS Corporation
9.9 Finetech
List of Tables
1 Global Underfill Material Market Outlook, By Region (2016-2026) (US $MN)
2 Global Underfill Material Market Outlook, By Product (2016-2026) (US $MN)
3 Global Underfill Material Market Outlook, By No Flow Underfill Material (NUF) (2016-2026) (US $MN)
4 Global Underfill Material Market Outlook, By Capillary Underfill Material (CUF) (2016-2026) (US $MN)
5 Global Underfill Material Market Outlook, By Molded Underfill Material (MUF) (2016-2026) (US $MN)
6 Global Underfill Material Market Outlook, By Application (2016-2026) (US $MN)
7 Global Underfill Material Market Outlook, By Chip Scale Packaging (CSP) (2016-2026) (US $MN)
8 Global Underfill Material Market Outlook, By Ball Grid Array (BGA) (2016-2026) (US $MN)
9 Global Underfill Material Market Outlook, By Flip Chips (2016-2026) (US $MN)
10 North America Underfill Material Market Outlook, By Country (2016-2026) (US $MN)
11 North America Underfill Material Market Outlook, By Product (2016-2026) (US $MN)
12 North America Underfill Material Market Outlook, By No Flow Underfill Material (NUF) (2016-2026) (US $MN)
13 North America Underfill Material Market Outlook, By Capillary Underfill Material (CUF) (2016-2026) (US $MN)
14 North America Underfill Material Market Outlook, By Molded Underfill Material (MUF) (2016-2026) (US $MN)
15 North America Underfill Material Market Outlook, By Application (2016-2026) (US $MN)
16 North America Underfill Material Market Outlook, By Chip Scale Packaging (CSP) (2016-2026) (US $MN)
17 North America Underfill Material Market Outlook, By Ball Grid Array (BGA) (2016-2026) (US $MN)
18 North America Underfill Material Market Outlook, By Flip Chips (2016-2026) (US $MN)
19 Europe Underfill Material Market Outlook, By Country (2016-2026) (US $MN)
20 Europe Underfill Material Market Outlook, By Product (2016-2026) (US $MN)
21 Europe Underfill Material Market Outlook, By No Flow Underfill Material (NUF) (2016-2026) (US $MN)
22 Europe Underfill Material Market Outlook, By Capillary Underfill Material (CUF) (2016-2026) (US $MN)
23 Europe Underfill Material Market Outlook, By Molded Underfill Material (MUF) (2016-2026) (US $MN)
24 Europe Underfill Material Market Outlook, By Application (2016-2026) (US $MN)
25 Europe Underfill Material Market Outlook, By Chip Scale Packaging (CSP) (2016-2026) (US $MN)
26 Europe Underfill Material Market Outlook, By Ball Grid Array (BGA) (2016-2026) (US $MN)
27 Europe Underfill Material Market Outlook, By Flip Chips (2016-2026) (US $MN)
28 Asia Pacific Underfill Material Market Outlook, By Country (2016-2026) (US $MN)
29 Asia Pacific Underfill Material Market Outlook, By Product (2016-2026) (US $MN)
30 Asia Pacific Underfill Material Market Outlook, By No Flow Underfill Material (NUF) (2016-2026) (US $MN)
31 Asia Pacific Underfill Material Market Outlook, By Capillary Underfill Material (CUF) (2016-2026) (US $MN)
32 Asia Pacific Underfill Material Market Outlook, By Molded Underfill Material (MUF) (2016-2026) (US $MN)
33 Asia Pacific Underfill Material Market Outlook, By Application (2016-2026) (US $MN)
34 Asia Pacific Underfill Material Market Outlook, By Chip Scale Packaging (CSP) (2016-2026) (US $MN)
35 Asia Pacific Underfill Material Market Outlook, By Ball Grid Array (BGA) (2016-2026) (US $MN)
36 Asia Pacific Underfill Material Market Outlook, By Flip Chips (2016-2026) (US $MN)
37 South America Underfill Material Market Outlook, By Country (2016-2026) (US $MN)
38 South America Underfill Material Market Outlook, By Product (2016-2026) (US $MN)
39 South America Underfill Material Market Outlook, By No Flow Underfill Material (NUF) (2016-2026) (US $MN)
40 South America Underfill Material Market Outlook, By Capillary Underfill Material (CUF) (2016-2026) (US $MN)
41 South America Underfill Material Market Outlook, By Molded Underfill Material (MUF) (2016-2026) (US $MN)
42 South America Underfill Material Market Outlook, By Application (2016-2026) (US $MN)
43 South America Underfill Material Market Outlook, By Chip Scale Packaging (CSP) (2016-2026) (US $MN)
44 South America Underfill Material Market Outlook, By Ball Grid Array (BGA) (2016-2026) (US $MN)
45 South America Underfill Material Market Outlook, By Flip Chips (2016-2026) (US $MN)
46 Middle East & Africa Underfill Material Market Outlook, By Country (2016-2026) (US $MN)
47 Middle East & Africa Underfill Material Market Outlook, By Product (2016-2026) (US $MN)
48 Middle East & Africa Underfill Material Market Outlook, By No Flow Underfill Material (NUF) (2016-2026) (US $MN)
49 Middle East & Africa Underfill Material Market Outlook, By Capillary Underfill Material (CUF) (2016-2026) (US $MN)
50 Middle East & Africa Underfill Material Market Outlook, By Molded Underfill Material (MUF) (2016-2026) (US $MN)
51 Middle East & Africa Underfill Material Market Outlook, By Application (2016-2026) (US $MN)
52 Middle East & Africa Underfill Material Market Outlook, By Chip Scale Packaging (CSP) (2016-2026) (US $MN)
53 Middle East & Africa Underfill Material Market Outlook, By Ball Grid Array (BGA) (2016-2026) (US $MN)
54 Middle East & Africa Underfill Material Market Outlook, By Flip Chips (2016-2026) (US $MN)
List of Figures
RESEARCH METHODOLOGY
We at ‘Stratistics’ opt for an extensive research approach which involves data mining, data validation, and data analysis. The various research sources include in-house repository, secondary research, competitor’s sources, social media research, client internal data, and primary research.
Our team of analysts prefers the most reliable and authenticated data sources in order to perform the comprehensive literature search. With access to most of the authenticated data bases our team highly considers the best mix of information through various sources to obtain extensive and accurate analysis.
Each report takes an average time of a month and a team of 4 industry analysts. The time may vary depending on the scope and data availability of the desired market report. The various parameters used in the market assessment are standardized in order to enhance the data accuracy.
Data Mining
The data is collected from several authenticated, reliable, paid and unpaid sources and is filtered depending on the scope & objective of the research. Our reports repository acts as an added advantage in this procedure. Data gathering from the raw material suppliers, distributors and the manufacturers is performed on a regular basis, this helps in the comprehensive understanding of the products value chain. Apart from the above mentioned sources the data is also collected from the industry consultants to ensure the objective of the study is in the right direction.
Market trends such as technological advancements, regulatory affairs, market dynamics (Drivers, Restraints, Opportunities and Challenges) are obtained from scientific journals, market related national & international associations and organizations.
Data Analysis
From the data that is collected depending on the scope & objective of the research the data is subjected for the analysis. The critical steps that we follow for the data analysis include:
- Product Lifecycle Analysis
- Competitor analysis
- Risk analysis
- Porters Analysis
- PESTEL Analysis
- SWOT Analysis
The data engineering is performed by the core industry experts considering both the Marketing Mix Modeling and the Demand Forecasting. The marketing mix modeling makes use of multiple-regression techniques to predict the optimal mix of marketing variables. Regression factor is based on a number of variables and how they relate to an outcome such as sales or profits.
Data Validation
The data validation is performed by the exhaustive primary research from the expert interviews. This includes telephonic interviews, focus groups, face to face interviews, and questionnaires to validate our research from all aspects. The industry experts we approach come from the leading firms, involved in the supply chain ranging from the suppliers, distributors to the manufacturers and consumers so as to ensure an unbiased analysis.
We are in touch with more than 15,000 industry experts with the right mix of consultants, CEO's, presidents, vice presidents, managers, experts from both supply side and demand side, executives and so on.
The data validation involves the primary research from the industry experts belonging to:
- Leading Companies
- Suppliers & Distributors
- Manufacturers
- Consumers
- Industry/Strategic Consultants
Apart from the data validation the primary research also helps in performing the fill gap research, i.e. providing solutions for the unmet needs of the research which helps in enhancing the reports quality.
For more details about research methodology, kindly write to us at info@strategymrc.com
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