Advanced Packaging Market
PUBLISHED: 2020 ID: SMRC19349
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Advanced Packaging Market

Advanced Packaging - Global Market Outlook (2019-2027)

4.5 (71 reviews)
4.5 (71 reviews)
Published: 2020 ID: SMRC19349

This report covers the impact of COVID-19 on this global market

According to Stratistics MRC, the Global Advanced Packaging Market is accounted for $29.42 billion in 2019 and is expected to reach $73.36 billion by 2027 growing at a CAGR of 12.1% during the forecast period. Some of the key factors propelling the market growth include exponential adoptions of IoT by various industry verticals, rising demand for smart as well as power-efficient devices by the consumers, increasing trend of advanced architecture in electronic products, and favourable government policies and regulations in developing countries. However, high initial costs of advanced packaging with higher maintenance costs of these systems are likely to hamper the market. Moreover, the rise in the usage of advanced packaging by the automotive industry is creating further large opportunities for the players operating in the advanced packaging market.

Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory, during the final stage of semiconductor manufacturing process. This packaging allows the chip to be connected to a circuit board. In addition, it involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

By technology, Fan-out wafer level packaging (FOWLP) has emerged as a promising technology to meet the ever increasing demands of the consumer electronic products. The main advantages of FOWLP are the substrate-less package, lower thermal resistance, a higher performance due to shorter interconnects together with direct IC connection by thin film metallization instead of wire bonds or flip chip bumps and lower parasitic effects.

On the basis of geography, Asia Pacific region is expected to have considerable market growth during the forecast timeline, owing to huge end-user demand for advanced packaging in the countries like China and India and growing population and the customer-side demand. Prominent semiconductor manufacturing companies present in the region are fueling the demand for advanced semiconductor packaging. Moreover, China is the largest growing economy with a large population and according to statistics from China’s semiconductor association, the import of IC is increasing for the consecutive year.

Some of the key players in advanced packaging market include ASE Technology Holding Co., Ltd., Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, Renesas Electronics Corporation, Texas Instruments, Amkor Technology, Inc., Intel Corporation, Semiconductor Manufacturing International Corporation, STATS ChipPAC Ltd, SÜSS MicroTec SE, International Business Machines Corporation, Microchip Technology, United Microelectronics Corporation, Samsung Electronics Co. Ltd, Chipbond Technology Corporation, and Advanced Semiconductor Engineering Inc.

Technologies Covered:
• Wafer Level CSP
• Flip Chip CSP
• Fan Out wafer-level packaging (FO WLP)
• Flip-Chip Ball Grid Array
• 2.5D/3D
• Chip-Scale Packaging
• 3D Integrated Circuit Packaging
• Fan Out Silicon in Package
• 3D Wafer Level Package
• Fan-in wafer-level packaging (FI WLP)
• 5D
• 3.0 DIC
• Other Types

End Users Covered:
• Healthcare
• Aerospace & Defense
• Consumer Electronics
• Automotive
• Industrial
• IT and Telecommunication
• Other End Users

Applications Covered:
• MEMS & Sensor
• Misc Logic and Memory
• Analog & Mixed Signal
• Wireless Connectivity
• Optoelectronic
• Light-emitting Diode (LED)

Products Covered:
• Intelligent Technology
• Modified Atmosphere
• Active Technology

Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o France
o Italy
o UK 
o Spain
o Rest of Europe      
• Asia Pacific
o Japan       
o China        
o India       
o Australia       
o New Zealand      
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter’s five forces analysis, SWOT analysis, etc.
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements

Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
o Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary   
    
2 Preface   

 2.1 Abstract  
 2.2 Stake Holders  
 2.3 Research Scope  
 2.4 Research Methodology  
  2.4.1 Data Mining 
  2.4.2 Data Analysis 
  2.4.3 Data Validation 
  2.4.4 Research Approach 
 2.5 Research Sources  
  2.5.1 Primary Research Sources 
  2.5.2 Secondary Research Sources 
  2.5.3 Assumptions 
    
3 Market Trend Analysis   
 3.1 Introduction  
 3.2 Drivers  
 3.3 Restraints  
 3.4 Opportunities  
 3.5 Threats  
 3.6 Technology Analysis  
 3.7 End User Analysis  
 3.8 Application Analysis  
 3.9 Product Analysis  
 3.10 Emerging Markets  
 3.11 Impact of Covid-19  
    
4 Porters Five Force Analysis   
 4.1 Bargaining power of suppliers  
 4.2 Bargaining power of buyers  
 4.3 Threat of substitutes  
 4.4 Threat of new entrants  
 4.5 Competitive rivalry  
    
5 Global Advanced Packaging Market, By Technology   
 5.1 Introduction  
 5.2 Wafer Level CSP  
 5.3 Flip Chip CSP  
 5.4 Fan Out wafer-level packaging (FO WLP)  
 5.5 Flip-Chip Ball Grid Array  
 5.6 2.5D/3D  
 5.7 Chip-Scale Packaging  
 5.8 3D Integrated Circuit Packaging  
 5.9 Fan Out Silicon in Package  
 5.10 3D Wafer Level Package  
 5.11 Fan-in wafer-level packaging (FI WLP)  
 5.12 5D  
 5.13 3.0 DIC  
 5.14 Other Types  
  5.14.1 Flip-Chip Package-in-Package 
  5.14.2 Embedded Die 
  5.14.3 Thin Quad Flat Packages 
    
6 Global Advanced Packaging Market, By End User   
 6.1 Introduction  
 6.2 Healthcare  
 6.3 Aerospace & Defense  
 6.4 Consumer Electronics  
 6.5 Automotive  
 6.6 Industrial  
 6.7 IT and Telecommunication  
 6.8 Other End Users  
  6.8.1 Paper & Pulp 
  6.8.2 Oil & Gas 
    
7 Global Advanced Packaging Market, By Application   
 7.1 Introduction  
 7.2 MEMS & Sensor  
 7.3 Misc Logic and Memory  
 7.4 Analog & Mixed Signal  
 7.5 Wireless Connectivity  
 7.6 Optoelectronic  
 7.7 Light-emitting Diode (LED)   
    
8 Global Advanced Packaging Market, By Product    
 8.1 Introduction  
 8.2 Intelligent Technology  
 8.3 Modified Atmosphere  
 8.4 Active Technology  
    
9 Global Advanced Packaging Market, By Geography   
 9.1 Introduction  
 9.2 North America  
  9.2.1 US 
  9.2.2 Canada 
  9.2.3 Mexico 
 9.3 Europe  
  9.3.1 Germany 
  9.3.2 UK 
  9.3.3 Italy 
  9.3.4 France 
  9.3.5 Spain 
  9.3.6 Rest of Europe 
 9.4 Asia Pacific  
  9.4.1 Japan 
  9.4.2 China 
  9.4.3 India 
  9.4.4 Australia 
  9.4.5 New Zealand 
  9.4.6 South Korea 
  9.4.7 Rest of Asia Pacific 
 9.5 South America  
  9.5.1 Argentina 
  9.5.2 Brazil 
  9.5.3 Chile 
  9.5.4 Rest of South America 
 9.6 Middle East & Africa  
  9.6.1 Saudi Arabia 
  9.6.2 UAE 
  9.6.3 Qatar 
  9.6.4 South Africa 
  9.6.5 Rest of Middle East & Africa 
    
10 Key Developments   
 10.1 Agreements, Partnerships, Collaborations and Joint Ventures  
 10.2 Acquisitions & Mergers  
 10.3 New Product Launch  
 10.4 Expansions  
 10.5 Other Key Strategies  
    
11 Company Profiling   
 11.1 ASE Technology Holding Co., Ltd.  
 11.2 Qualcomm Technologies Inc.  
 11.3 Taiwan Semiconductor Manufacturing Company  
 11.4 Renesas Electronics Corporation  
 11.5 Texas Instruments  
 11.6 Amkor Technology, Inc.  
 11.7 Intel Corporation  
 11.8 Semiconductor Manufacturing International Corporation,  
 11.9 STATS ChipPAC Ltd  
 11.10 SÜSS MicroTec SE  
 11.11 International Business Machines Corporation  
 11.12 Microchip Technology  
 11.13 United Microelectronics Corporation  
 11.14 Samsung Electronics Co. Ltd  
 11.15 Chipbond Technology Corporation  
 11.16 Advanced Semiconductor Engineering Inc. 


List of Tables    
1 Global Advanced Packaging Market Outlook, By Region (2018-2027) ($MN)   
2 Global Advanced Packaging Market Outlook, By Technology (2018-2027) ($MN)   
3 Global Advanced Packaging Market Outlook, By Wafer Level CSP (2018-2027) ($MN)   
4 Global Advanced Packaging Market Outlook, By Flip Chip CSP (2018-2027) ($MN)   
5 Global Advanced Packaging Market Outlook, By Fan Out wafer-level packaging (FO WLP) (2018-2027) ($MN)   
6 Global Advanced Packaging Market Outlook, By Flip-Chip Ball Grid Array (2018-2027) ($MN)   
7 Global Advanced Packaging Market Outlook, By 2.5D/3D (2018-2027) ($MN)   
8 Global Advanced Packaging Market Outlook, By Chip-Scale Packaging (2018-2027) ($MN)   
9 Global Advanced Packaging Market Outlook, By 3D Integrated Circuit Packaging (2018-2027) ($MN)   
10 Global Advanced Packaging Market Outlook, By Fan Out Silicon in Package (2018-2027) ($MN)   
11 Global Advanced Packaging Market Outlook, By 3D Wafer Level Package (2018-2027) ($MN)   
12 Global Advanced Packaging Market Outlook, By Fan-in wafer-level packaging (FI WLP) (2018-2027) ($MN)   
13 Global Advanced Packaging Market Outlook, By 5D (2018-2027) ($MN)   
14 Global Advanced Packaging Market Outlook, By 3.0 DIC (2018-2027) ($MN)   
15 Global Advanced Packaging Market Outlook, By Other Types (2018-2027) ($MN)   
16 Global Advanced Packaging Market Outlook, By Flip-Chip Package-in-Package (2018-2027) ($MN)   
17 Global Advanced Packaging Market Outlook, By Embedded Die (2018-2027) ($MN)   
18 Global Advanced Packaging Market Outlook, By Thin Quad Flat Packages (2018-2027) ($MN)   
19 Global Advanced Packaging Market Outlook, By End User (2018-2027) ($MN)   
20 Global Advanced Packaging Market Outlook, By Healthcare (2018-2027) ($MN)   
21 Global Advanced Packaging Market Outlook, By Aerospace & Defense (2018-2027) ($MN)   
22 Global Advanced Packaging Market Outlook, By Consumer Electronics (2018-2027) ($MN)   
23 Global Advanced Packaging Market Outlook, By Automotive (2018-2027) ($MN)   
24 Global Advanced Packaging Market Outlook, By Industrial (2018-2027) ($MN)   
25 Global Advanced Packaging Market Outlook, By IT and Telecommunication (2018-2027) ($MN)   
26 Global Advanced Packaging Market Outlook, By Other End Users (2018-2027) ($MN)   
27 Global Advanced Packaging Market Outlook, By Paper & Pulp (2018-2027) ($MN)   
28 Global Advanced Packaging Market Outlook, By Oil & Gas (2018-2027) ($MN)   
29 Global Advanced Packaging Market Outlook, By Application (2018-2027) ($MN)   
30 Global Advanced Packaging Market Outlook, By MEMS & Sensor (2018-2027) ($MN)   
31 Global Advanced Packaging Market Outlook, By Misc Logic and Memory (2018-2027) ($MN)   
32 Global Advanced Packaging Market Outlook, By Analog & Mixed Signal (2018-2027) ($MN)   
33 Global Advanced Packaging Market Outlook, By Wireless Connectivity (2018-2027) ($MN)   
34 Global Advanced Packaging Market Outlook, By Optoelectronic (2018-2027) ($MN)   
35 Global Advanced Packaging Market Outlook, By Light-emitting Diode (LED) (2018-2027) ($MN)   
36 Global Advanced Packaging Market Outlook, By Product (2018-2027) ($MN)   
37 Global Advanced Packaging Market Outlook, By Intelligent Technology (2018-2027) ($MN)   
38 Global Advanced Packaging Market Outlook, By Modified Atmosphere (2018-2027) ($MN)   
39 Global Advanced Packaging Market Outlook, By Active Technology (2018-2027) ($MN)   
     
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.    

List of Figures

RESEARCH METHODOLOGY


Research Methodology

We at Stratistics opt for an extensive research approach which involves data mining, data validation, and data analysis. The various research sources include in-house repository, secondary research, competitor’s sources, social media research, client internal data, and primary research.

Our team of analysts prefers the most reliable and authenticated data sources in order to perform the comprehensive literature search. With access to most of the authenticated data bases our team highly considers the best mix of information through various sources to obtain extensive and accurate analysis.

Each report takes an average time of a month and a team of 4 industry analysts. The time may vary depending on the scope and data availability of the desired market report. The various parameters used in the market assessment are standardized in order to enhance the data accuracy.

Data Mining

The data is collected from several authenticated, reliable, paid and unpaid sources and is filtered depending on the scope & objective of the research. Our reports repository acts as an added advantage in this procedure. Data gathering from the raw material suppliers, distributors and the manufacturers is performed on a regular basis, this helps in the comprehensive understanding of the products value chain. Apart from the above mentioned sources the data is also collected from the industry consultants to ensure the objective of the study is in the right direction.

Market trends such as technological advancements, regulatory affairs, market dynamics (Drivers, Restraints, Opportunities and Challenges) are obtained from scientific journals, market related national & international associations and organizations.

Data Analysis

From the data that is collected depending on the scope & objective of the research the data is subjected for the analysis. The critical steps that we follow for the data analysis include:

  • Product Lifecycle Analysis
  • Competitor analysis
  • Risk analysis
  • Porters Analysis
  • PESTEL Analysis
  • SWOT Analysis

The data engineering is performed by the core industry experts considering both the Marketing Mix Modeling and the Demand Forecasting. The marketing mix modeling makes use of multiple-regression techniques to predict the optimal mix of marketing variables. Regression factor is based on a number of variables and how they relate to an outcome such as sales or profits.


Data Validation

The data validation is performed by the exhaustive primary research from the expert interviews. This includes telephonic interviews, focus groups, face to face interviews, and questionnaires to validate our research from all aspects. The industry experts we approach come from the leading firms, involved in the supply chain ranging from the suppliers, distributors to the manufacturers and consumers so as to ensure an unbiased analysis.

We are in touch with more than 15,000 industry experts with the right mix of consultants, CEO's, presidents, vice presidents, managers, experts from both supply side and demand side, executives and so on.

The data validation involves the primary research from the industry experts belonging to:

  • Leading Companies
  • Suppliers & Distributors
  • Manufacturers
  • Consumers
  • Industry/Strategic Consultants

Apart from the data validation the primary research also helps in performing the fill gap research, i.e. providing solutions for the unmet needs of the research which helps in enhancing the reports quality.


For more details about research methodology, kindly write to us at info@strategymrc.com

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