Advanced Packaging - Global Market Outlook (2019-2027)
According to Stratistics MRC, the Global Advanced Packaging Market is accounted for $29.42 billion in 2019 and is expected to reach $73.36 billion by 2027 growing at a CAGR of 12.1% during the forecast period. Some of the key factors propelling the market growth include exponential adoptions of IoT by various industry verticals, rising demand for smart as well as power-efficient devices by the consumers, increasing trend of advanced architecture in electronic products, and favourable government policies and regulations in developing countries. However, high initial costs of advanced packaging with higher maintenance costs of these systems are likely to hamper the market. Moreover, the rise in the usage of advanced packaging by the automotive industry is creating further large opportunities for the players operating in the advanced packaging market.
Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory, during the final stage of semiconductor manufacturing process. This packaging allows the chip to be connected to a circuit board. In addition, it involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.
By technology, Fan-out wafer level packaging (FOWLP) has emerged as a promising technology to meet the ever increasing demands of the consumer electronic products. The main advantages of FOWLP are the substrate-less package, lower thermal resistance, a higher performance due to shorter interconnects together with direct IC connection by thin film metallization instead of wire bonds or flip chip bumps and lower parasitic effects.
On the basis of geography, Asia Pacific region is expected to have considerable market growth during the forecast timeline, owing to huge end-user demand for advanced packaging in the countries like China and India and growing population and the customer-side demand. Prominent semiconductor manufacturing companies present in the region are fueling the demand for advanced semiconductor packaging. Moreover, China is the largest growing economy with a large population and according to statistics from China’s semiconductor association, the import of IC is increasing for the consecutive year.
Some of the key players in advanced packaging market include ASE Technology Holding Co., Ltd., Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, Renesas Electronics Corporation, Texas Instruments, Amkor Technology, Inc., Intel Corporation, Semiconductor Manufacturing International Corporation, STATS ChipPAC Ltd, SÜSS MicroTec SE, International Business Machines Corporation, Microchip Technology, United Microelectronics Corporation, Samsung Electronics Co. Ltd, Chipbond Technology Corporation, and Advanced Semiconductor Engineering Inc.
• Wafer Level CSP
• Flip Chip CSP
• Fan Out wafer-level packaging (FO WLP)
• Flip-Chip Ball Grid Array
• Chip-Scale Packaging
• 3D Integrated Circuit Packaging
• Fan Out Silicon in Package
• 3D Wafer Level Package
• Fan-in wafer-level packaging (FI WLP)
• 3.0 DIC
• Other Types
End Users Covered:
• Aerospace & Defense
• Consumer Electronics
• IT and Telecommunication
• Other End Users
• MEMS & Sensor
• Misc Logic and Memory
• Analog & Mixed Signal
• Wireless Connectivity
• Light-emitting Diode (LED)
• Intelligent Technology
• Modified Atmosphere
• Active Technology
• North America
o Rest of Europe
• Asia Pacific
o New Zealand
o Rest of Asia Pacific
• South America
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o South Africa
o Rest of Middle East & Africa
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- Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
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- Supply chain trends mapping the latest technological advancements
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