Advanced Packaging Technologies Market
PUBLISHED: 2019 ID: SMRC18224
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Advanced Packaging Technologies Market

Advanced Packaging Technologies - Global Market Outlook (2017-2026)

4.3 (22 reviews)
4.3 (22 reviews)
Published: 2019 ID: SMRC18224

This report covers the impact of COVID-19 on this global market

According to Stratistics MRC, the Advanced Packaging Technology Market is growing at a CAGR of 8.6% from 2017 to 2026. The growth factors include increasing demand for fresh and quality packaged food, manufacturer concern for the longer shelf life of the food products, imminent requirement for size reduction in electronic devices, less power consumption. However, the heating problem in devices restrains the market growth.

Advanced packaging technology is intended to the commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes.

Based on Technology, the active packaging technologies systems anticipated with foods, pharmaceuticals, and several other types of products. They help extend shelf life, monitor freshness, display information on quality, improve safety, and improve convenience. Active packaging involves in having active functions beyond the inert passive containment and protection of the product. Intelligent and smart packaging usually involves the ability to sense or measure an attribute of the product, the inner atmosphere of the package, or the shipping environment. 

By Geography, Asia-Pacific is expected to grow at a healthy rate, being a major revenue provoking region during the forecast period, primarily owing to the growing population and the customer-side demand.

Some of the key players include in this market 3M Company, Crown Holdings, Inc., Amcor Limited, PakSense Inc., Thin Film Electronics ASA, CCL Industries Inc., Sealed Air Corporation, Vitsab International AB, Landec Corporation, Timestrip U.K. Ltd., LCR Hallcrest LLC, Bemis Company, Inc., Temptime Corporation, Cryolog S.A., SYSCO Corporation.

Types Covered:
• Flip Chip
• 2.5D Integrated Circuit
• Fan Out Silicon in Package
• 2D Integrated Circuit
• 3D Integrated Circuit
• Flip Chip
• Wafer Level Chip Scale Package
• Other Type

Technologies Covered:
• Smart and Intelligent Packaging
• Active Packaging

End-Users Covered:
• Aerospace & Defense
• Consumer Electronics
• IT & Telecommunication
• Industrial
• Aerospace & Defense
• Healthcare
• Automotive & Transport
• Other End Users

Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan        
o China        
o India        
o Australia  
o New Zealand
o South Korea
o Rest of Asia Pacific    
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa 
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa

What our report offers:
o - Market share assessments for the regional and country level segments
o - Strategic recommendations for the new entrants
o - Market forecasts for a minimum of 9 years of all the mentioned segments, sub segments and the regional markets
o - Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
o - Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter’s five forces analysis, SWOT analysis etc.
o - Strategic recommendations in key business segments based on the market estimations
o - Competitive landscaping mapping the key common trends
o - Company profiling with detailed strategies, financials, and recent developments
o - Supply chain trends mapping the latest technological advancements


Free Customization Offerings:
o All the customers of this report will be entitled to receive one of the following free customization options:
o Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
o Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the clients interest (Note: Depends of feasibility check)
o Competitive Benchmarking
o Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances.

Table of Contents

1 Executive Summary      
        
2 Preface       
 2.1 Abstract      
 2.2 Stake Holders     
 2.3 Research Scope     
 2.4 Research Methodology    
  2.4.1 Data Mining    
  2.4.2 Data Analysis    
  2.4.3 Data Validation    
  2.4.4 Research Approach    
 2.5 Research Sources     
  2.5.1 Primary Research Sources   
  2.5.2 Secondary Research Sources   
  2.5.3 Assumptions    
        
3 Market Trend Analysis     
 3.1 Introduction     
 3.2 Drivers      
 3.3 Restraints     
 3.4 Opportunities     
 3.5 Threats      
 3.6 Technology Analysis    
 3.7 End User Analysis     
 3.8 Emerging Markets     
 3.9 Futuristic Market Scenario    
        
4 Porters Five Force Analysis     
 4.1 Bargaining power of suppliers    
 4.2 Bargaining power of buyers    
 4.3 Threat of substitutes    
 4.4 Threat of new entrants    
 4.5 Competitive rivalry     
        
5 Global Advanced Packaging Technologies Market, By Type  
 5.1 Introduction     
 5.2 Flip Chip      
 5.3 2.5D Integrated Circuit    
 5.4 Fan Out Silicon in Package    
 5.5 2D Integrated Circuit    
 5.6 3D Integrated Circuit    
 5.7 Flip Chip      
 5.8 Wafer Level Chip Scale Package   
 5.9 Other Types     
        
6 Global Advanced Packaging Technologies Market, By Technology 
 6.1 Introduction     
 6.2 Smart and Intelligent Packaging   
  6.2.1 Radio Frequency Identification (RFID)  
  6.2.2 Freshness Indicators   
  6.2.3 TTI Tags & Labels    
  6.2.4 Oxygen and CO2 Indicators   
  6.2.5 Other Technologies    
 6.3 Active Packaging     
  6.3.1 Temperature Control Packaging  
  6.3.2 Modified Atmosphere Packaging  
  6.3.3 Active Packaging Systems   
   6.3.3.1 Ethylene Absorbers   
   6.3.3.2 Moisture Scavengers/Absorbers 
   6.3.3.3 Oxygen Scavengers   
  6.3.4 Active Releasing Systems   
   6.3.4.1 Carbon Dioxide Emitters  
   6.3.4.2 Antioxidant Releasers  
        
7 Global Advanced Packaging Technologies Market, By End User 
 7.1 Introduction     
 7.2 Aerospace & Defense    
 7.3 Consumer Electronics    
 7.4 IT & Telecommunication    
 7.5 Industrial      
 7.6 Healthcare     
 7.7 Automotive & Transport    
 7.8 Other End Users     
        
8 Global Advanced Packaging Technologies Market, By Geography 
 8.1 Introduction     
 8.2 North America     
  8.2.1 US     
  8.2.2 Canada     
  8.2.3 Mexico     
 8.3 Europe      
  8.3.1 Germany     
  8.3.2 UK     
  8.3.3 Italy     
  8.3.4 France     
  8.3.5 Spain     
  8.3.6 Rest of Europe    
 8.4 Asia Pacific     
  8.4.1 Japan     
  8.4.2 China     
  8.4.3 India     
  8.4.4 Australia     
  8.4.5 New Zealand    
  8.4.6 South Korea    
  8.4.7 Rest of Asia Pacific    
 8.5 South America     
  8.5.1 Argentina    
  8.5.2 Brazil     
  8.5.3 Chile     
  8.5.4 Rest of South America   
 8.6 Middle East & Africa    
  8.6.1 Saudi Arabia    
  8.6.2 UAE     
  8.6.3 Qatar     
  8.6.4 South Africa    
  8.6.5 Rest of Middle East & Africa   
        
9 Key Developments      
 9.1 Agreements, Partnerships, Collaborations and Joint Ventures 
 9.2 Acquisitions & Mergers    
 9.3 New Product Launch    
 9.4 Expansions     
 9.5 Other Key Strategies    
        
10 Company Profiling      
 10.1 3M Company     
 10.2 Crown Holdings, Inc.    
 10.3 Amcor Limited     
 10.4 PakSense Inc.     
 10.5 Thin Film Electronics ASA    
 10.6 CCL Industries Inc.     
 10.7 Sealed Air Corporation    
 10.8 Vitsab International AB    
 10.9 Landec Corporation     
 10.10 Timestrip U.K. Ltd.     
 10.11 LCR Hallcrest LLC     
 10.12 Bemis Company, Inc.    
 10.13 Temptime Corporation    
 10.14 Cryolog S.A.     
 10.15 SYSCO Corporation            


List of Tables       
1 Global Advanced Packaging Technologies Market Outlook, By Region (2016-2026) ($MN)
2 Global Advanced Packaging Technologies Market Outlook, By Type (2016-2026) ($MN)
3 Global Advanced Packaging Technologies Market Outlook, By Flip Chip (2016-2026) ($MN)
4 Global Advanced Packaging Technologies Market Outlook, By 2.5D Integrated Circuit (2016-2026) ($MN)
5 Global Advanced Packaging Technologies Market Outlook, By Fan Out Silicon in Package (2016-2026) ($MN)
6 Global Advanced Packaging Technologies Market Outlook, By 2D Integrated Circuit (2016-2026) ($MN)
7 Global Advanced Packaging Technologies Market Outlook, By 3D Integrated Circuit (2016-2026) ($MN)
8 Global Advanced Packaging Technologies Market Outlook, By Flip Chip (2016-2026) ($MN)
9 Global Advanced Packaging Technologies Market Outlook, By Wafer Level Chip Scale Package (2016-2026) ($MN)
10 Global Advanced Packaging Technologies Market Outlook, By Other Types (2016-2026) ($MN)
11 Global Advanced Packaging Technologies Market Outlook, By Technology (2016-2026) ($MN)
12 Global Advanced Packaging Technologies Market Outlook, By Smart and Intelligent Packaging (2016-2026) ($MN)
13 Global Advanced Packaging Technologies Market Outlook, By Radio Frequency Identification (RFID) (2016-2026) ($MN)
14 Global Advanced Packaging Technologies Market Outlook, By Freshness Indicators (2016-2026) ($MN)
15 Global Advanced Packaging Technologies Market Outlook, By TTI Tags & Labels (2016-2026) ($MN)
16 Global Advanced Packaging Technologies Market Outlook, By Oxygen and CO2 Indicators (2016-2026) ($MN)
17 Global Advanced Packaging Technologies Market Outlook, By Other Technologies (2016-2026) ($MN)
18 Global Advanced Packaging Technologies Market Outlook, By Active Packaging (2016-2026) ($MN)
19 Global Advanced Packaging Technologies Market Outlook, By Temperature Control Packaging (2016-2026) ($MN)
20 Global Advanced Packaging Technologies Market Outlook, By Modified Atmosphere Packaging (2016-2026) ($MN)
21 Global Advanced Packaging Technologies Market Outlook, By Active Packaging Systems (2016-2026) ($MN)
22 Global Advanced Packaging Technologies Market Outlook, By Active Releasing Systems (2016-2026) ($MN)
23 Global Advanced Packaging Technologies Market Outlook, By End User (2016-2026) ($MN)
24 Global Advanced Packaging Technologies Market Outlook, By Aerospace & Defense (2016-2026) ($MN)
25 Global Advanced Packaging Technologies Market Outlook, By Consumer Electronics (2016-2026) ($MN)
26 Global Advanced Packaging Technologies Market Outlook, By IT & Telecommunication (2016-2026) ($MN)
27 Global Advanced Packaging Technologies Market Outlook, By Industrial (2016-2026) ($MN)
28 Global Advanced Packaging Technologies Market Outlook, By Healthcare (2016-2026) ($MN)
29 Global Advanced Packaging Technologies Market Outlook, By Automotive & Transport (2016-2026) ($MN)
30 Global Advanced Packaging Technologies Market Outlook, By Other End Users (2016-2026) ($MN)
        
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above. 

 

List of Figures

RESEARCH METHODOLOGY


Research Methodology

We at Stratistics opt for an extensive research approach which involves data mining, data validation, and data analysis. The various research sources include in-house repository, secondary research, competitor’s sources, social media research, client internal data, and primary research.

Our team of analysts prefers the most reliable and authenticated data sources in order to perform the comprehensive literature search. With access to most of the authenticated data bases our team highly considers the best mix of information through various sources to obtain extensive and accurate analysis.

Each report takes an average time of a month and a team of 4 industry analysts. The time may vary depending on the scope and data availability of the desired market report. The various parameters used in the market assessment are standardized in order to enhance the data accuracy.

Data Mining

The data is collected from several authenticated, reliable, paid and unpaid sources and is filtered depending on the scope & objective of the research. Our reports repository acts as an added advantage in this procedure. Data gathering from the raw material suppliers, distributors and the manufacturers is performed on a regular basis, this helps in the comprehensive understanding of the products value chain. Apart from the above mentioned sources the data is also collected from the industry consultants to ensure the objective of the study is in the right direction.

Market trends such as technological advancements, regulatory affairs, market dynamics (Drivers, Restraints, Opportunities and Challenges) are obtained from scientific journals, market related national & international associations and organizations.

Data Analysis

From the data that is collected depending on the scope & objective of the research the data is subjected for the analysis. The critical steps that we follow for the data analysis include:

  • Product Lifecycle Analysis
  • Competitor analysis
  • Risk analysis
  • Porters Analysis
  • PESTEL Analysis
  • SWOT Analysis

The data engineering is performed by the core industry experts considering both the Marketing Mix Modeling and the Demand Forecasting. The marketing mix modeling makes use of multiple-regression techniques to predict the optimal mix of marketing variables. Regression factor is based on a number of variables and how they relate to an outcome such as sales or profits.


Data Validation

The data validation is performed by the exhaustive primary research from the expert interviews. This includes telephonic interviews, focus groups, face to face interviews, and questionnaires to validate our research from all aspects. The industry experts we approach come from the leading firms, involved in the supply chain ranging from the suppliers, distributors to the manufacturers and consumers so as to ensure an unbiased analysis.

We are in touch with more than 15,000 industry experts with the right mix of consultants, CEO's, presidents, vice presidents, managers, experts from both supply side and demand side, executives and so on.

The data validation involves the primary research from the industry experts belonging to:

  • Leading Companies
  • Suppliers & Distributors
  • Manufacturers
  • Consumers
  • Industry/Strategic Consultants

Apart from the data validation the primary research also helps in performing the fill gap research, i.e. providing solutions for the unmet needs of the research which helps in enhancing the reports quality.


For more details about research methodology, kindly write to us at info@strategymrc.com

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