Die Attach Equipment Market
Die Attach Equipment - Global Market Outlook (2018-2027)
According to Stratistics MRC, the Global Die Attach Equipment market is expected to growing at a CAGR of 7.8% during the forecast period. Some of the key factors propelling the market growth include growing demand of ausn eutectic die-attach technology, increasing demand of discrete power devices, Rising demand for compact devices, and growing adoption of copper clips. However, dimensional changes during processing and service life and mechanical unbalance are restricting the market growth.
Die attach is a key process step in semiconductor packaging. It covers all devices across various applications and is a key contributor to assembly cost. The die attach equipment business will benefit from assembly and packaging opportunities created by the above-mentioned trends. This equipment can be classified into two categories: die bonders and flip-chip (FC) bonders. The die attach equipment offering includes multi-chip bonders for advanced packaging through market techniques such as epoxy, soft solder bonders, etc. to various applications such as Memory, RF & MEMS, LED, etc.
By application, light-emitting diode (LED) segment is expected to grow at the significant rate during the forecast period. Die attach material represents a key role in the performance and reliability of mid, high, and super-high power LEDs. With an increasing LED penetration rate, the demand for die-attach equipment is increasing. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and the sintered materials have all been used for LED die attach.
On the basis of geography, Asia Pacific region is anticipated to witness considerable market growth during the forecast period, due to increasing number of IDMs (Integrated Device Manufacturer) in the region. The mass production of electronic products, which includes smartphones, wearables, and white goods, in China and Taiwan, makes use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die-attach equipment in the assembly process of these components. Furthermore, India is also witnessing growth in a number of smart cities, due to government initiatives and is expected to incorporate electronic solutions for purposes, such as surveillance, maintenance, monitoring, etc.
Some of the key players in die attach equipment market include Fasford Technology Co Ltd., ASM Pacific Technology Limited, Inseto UK Limited, Kulicke and Soffa Industries, Inc., Anza Technology Inc., Be Semiconductor Industries N.V., Palomar Technologies, Inc., Dr. Tresky AG, Shinkawa Ltd., Toray Engineering, MicroAssembly Technologies, Ltd., DIAS Automation, Panasonic, West-Bond, and Hybond.
Bonding Techniques Covered:
• Soft Solder
• Hybrid Bonding
• Epoxy
• Eutectic
• Sintering
• Mass Reflow
• Thermo-Compression Bonding (TCB)
• Laser Assisted Bonding (LAB)
Types Covered:
• Flip Chip Bonder
• Die Bonder
Applications Covered:
• Logic
• Optoelectronics / Photonics
• RF & MEMS
• Light-Emitting Diode (LED)
• CMOS Image Sensor
• Memory
• Discretes
• Integrated Device Manufacturers (IDMs)
• Outsourced Semiconductor Assembly and Test (OSAT)
Product Types Covered:
• 12 Wafer Handling
• 8 Wafer Handling
• 6 Wafer Handling
Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o France
o Italy
o UK
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2017, 2018, 2019, 2023 and 2027
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter’s five forces analysis, SWOT analysis, etc.
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
o Comprehensive profiling of additional market players (up to 3)
o SWOT Analysis of key players (up to 3)
• Regional Segmentation
o Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
o Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Table of Contents
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Product Analysis
3.7 Application Analysis
3.8 Emerging Markets
3.9 Impact of Covid-19
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Die Attach Equipment Market, By Bonding Technique
5.1 Introduction
5.2 Soft Solder
5.3 Hybrid Bonding
5.4 Epoxy
5.5 Eutectic
5.6 Sintering
5.7 Mass Reflow
5.8 Thermo-Compression Bonding (TCB)
5.9 Laser Assisted Bonding (LAB)
6 Global Die Attach Equipment Market, By Type
6.1 Introduction
6.2 Flip Chip Bonder
6.3 Die Bonder
7 Global Die Attach Equipment Market, By Application
7.1 Introduction
7.2 Logic
7.3 Optoelectronics / Photonics
7.4 RF & MEMS
7.5 Light-Emitting Diode (LED)
7.6 CMOS Image Sensor
7.7 Memory
7.7.1 DRAM
7.7.2 NAND
7.7.3 3D TSV Memory
7.8 Discretes
7.9 Integrated Device Manufacturers (IDMs)
7.10 Outsourced Semiconductor Assembly and Test (OSAT)
8 Global Die Attach Equipment Market, By Product Type
8.1 Introduction
8.2 12 Wafer Handling
8.3 8 Wafer Handling
8.4 6 Wafer Handling
9 Global Die Attach Equipment Market, By Geography
9.1 Introduction
9.2 North America
9.2.1 US
9.2.2 Canada
9.2.3 Mexico
9.3 Europe
9.3.1 Germany
9.3.2 UK
9.3.3 Italy
9.3.4 France
9.3.5 Spain
9.3.6 Rest of Europe
9.4 Asia Pacific
9.4.1 Japan
9.4.2 China
9.4.3 India
9.4.4 Australia
9.4.5 New Zealand
9.4.6 South Korea
9.4.7 Rest of Asia Pacific
9.5 South America
9.5.1 Argentina
9.5.2 Brazil
9.5.3 Chile
9.5.4 Rest of South America
9.6 Middle East & Africa
9.6.1 Saudi Arabia
9.6.2 UAE
9.6.3 Qatar
9.6.4 South Africa
9.6.5 Rest of Middle East & Africa
10 Key Developments
10.1 Agreements, Partnerships, Collaborations and Joint Ventures
10.2 Acquisitions & Mergers
10.3 New Product Launch
10.4 Expansions
10.5 Other Key Strategies
11 Company Profiling
11.1 Fasford Technology Co Ltd.
11.2 ASM Pacific Technology Limited
11.3 Inseto UK Limited
11.4 Kulicke and Soffa Industries, Inc.
11.5 Anza Technology Inc.
11.6 Be Semiconductor Industries N.V.
11.7 Palomar Technologies, Inc.
11.8 Dr. Tresky AG
11.9 Shinkawa Ltd.
11.10 Toray Engineering
11.11 MicroAssembly Technologies, Ltd.
11.12 DIAS Automation
11.13 Panasonic
11.14 West-Bond
11.15 Hybond
List of Tables
1 Global Die Attach Equipment Market Outlook, By Region (2017-2027) ($MN)
2 Global Die Attach Equipment Market Outlook, By Bonding Technique (2017-2027) ($MN)
3 Global Die Attach Equipment Market Outlook, By Soft Solder (2017-2027) ($MN)
4 Global Die Attach Equipment Market Outlook, By Hybrid Bonding (2017-2027) ($MN)
5 Global Die Attach Equipment Market Outlook, By Epoxy (2017-2027) ($MN)
6 Global Die Attach Equipment Market Outlook, By Eutectic (2017-2027) ($MN)
7 Global Die Attach Equipment Market Outlook, By Sintering (2017-2027) ($MN)
8 Global Die Attach Equipment Market Outlook, By Mass Reflow (2017-2027) ($MN)
9 Global Die Attach Equipment Market Outlook, By Thermo-Compression Bonding (TCB) (2017-2027) ($MN)
10 Global Die Attach Equipment Market Outlook, By Laser Assisted Bonding (LAB) (2017-2027) ($MN)
11 Global Die Attach Equipment Market Outlook, By Type (2017-2027) ($MN)
12 Global Die Attach Equipment Market Outlook, By Flip Chip Bonder (2017-2027) ($MN)
13 Global Die Attach Equipment Market Outlook, By Die Bonder (2017-2027) ($MN)
14 Global Die Attach Equipment Market Outlook, By Application (2017-2027) ($MN)
15 Global Die Attach Equipment Market Outlook, By Logic (2017-2027) ($MN)
16 Global Die Attach Equipment Market Outlook, By Optoelectronics / Photonics (2017-2027) ($MN)
17 Global Die Attach Equipment Market Outlook, By RF & MEMS (2017-2027) ($MN)
18 Global Die Attach Equipment Market Outlook, By Light-Emitting Diode (LED) (2017-2027) ($MN)
19 Global Die Attach Equipment Market Outlook, By CMOS Image Sensor (2017-2027) ($MN)
20 Global Die Attach Equipment Market Outlook, By Memory (2017-2027) ($MN)
21 Global Die Attach Equipment Market Outlook, By DRAM (2017-2027) ($MN)
22 Global Die Attach Equipment Market Outlook, By NAND (2017-2027) ($MN)
23 Global Die Attach Equipment Market Outlook, By 3D TSV Memory (2017-2027) ($MN)
24 Global Die Attach Equipment Market Outlook, By Discretes (2017-2027) ($MN)
25 Global Die Attach Equipment Market Outlook, By Integrated Device Manufacturers (IDMs) (2017-2027) ($MN)
26 Global Die Attach Equipment Market Outlook, By Outsourced Semiconductor Assembly and Test (OSAT) (2017-2027) ($MN)
27 Global Die Attach Equipment Market Outlook, By Product Type (2017-2027) ($MN)
28 Global Die Attach Equipment Market Outlook, By 12 Wafer Handling (2017-2027) ($MN)
29 Global Die Attach Equipment Market Outlook, By 8 Wafer Handling (2017-2027) ($MN)
30 Global Die Attach Equipment Market Outlook, By 6 Wafer Handling (2017-2027) ($MN)
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.
List of Figures
RESEARCH METHODOLOGY
We at ‘Stratistics’ opt for an extensive research approach which involves data mining, data validation, and data analysis. The various research sources include in-house repository, secondary research, competitor’s sources, social media research, client internal data, and primary research.
Our team of analysts prefers the most reliable and authenticated data sources in order to perform the comprehensive literature search. With access to most of the authenticated data bases our team highly considers the best mix of information through various sources to obtain extensive and accurate analysis.
Each report takes an average time of a month and a team of 4 industry analysts. The time may vary depending on the scope and data availability of the desired market report. The various parameters used in the market assessment are standardized in order to enhance the data accuracy.
Data Mining
The data is collected from several authenticated, reliable, paid and unpaid sources and is filtered depending on the scope & objective of the research. Our reports repository acts as an added advantage in this procedure. Data gathering from the raw material suppliers, distributors and the manufacturers is performed on a regular basis, this helps in the comprehensive understanding of the products value chain. Apart from the above mentioned sources the data is also collected from the industry consultants to ensure the objective of the study is in the right direction.
Market trends such as technological advancements, regulatory affairs, market dynamics (Drivers, Restraints, Opportunities and Challenges) are obtained from scientific journals, market related national & international associations and organizations.
Data Analysis
From the data that is collected depending on the scope & objective of the research the data is subjected for the analysis. The critical steps that we follow for the data analysis include:
- Product Lifecycle Analysis
- Competitor analysis
- Risk analysis
- Porters Analysis
- PESTEL Analysis
- SWOT Analysis
The data engineering is performed by the core industry experts considering both the Marketing Mix Modeling and the Demand Forecasting. The marketing mix modeling makes use of multiple-regression techniques to predict the optimal mix of marketing variables. Regression factor is based on a number of variables and how they relate to an outcome such as sales or profits.
Data Validation
The data validation is performed by the exhaustive primary research from the expert interviews. This includes telephonic interviews, focus groups, face to face interviews, and questionnaires to validate our research from all aspects. The industry experts we approach come from the leading firms, involved in the supply chain ranging from the suppliers, distributors to the manufacturers and consumers so as to ensure an unbiased analysis.
We are in touch with more than 15,000 industry experts with the right mix of consultants, CEO's, presidents, vice presidents, managers, experts from both supply side and demand side, executives and so on.
The data validation involves the primary research from the industry experts belonging to:
- Leading Companies
- Suppliers & Distributors
- Manufacturers
- Consumers
- Industry/Strategic Consultants
Apart from the data validation the primary research also helps in performing the fill gap research, i.e. providing solutions for the unmet needs of the research which helps in enhancing the reports quality.
For more details about research methodology, kindly write to us at info@strategymrc.com
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